SNAS678C May   2018  – July 2021 HDC2080

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Description (continued)
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Switching Characteristics
    7. 7.7 Timing Diagram
    8. 7.8 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Sleep Mode Power Consumption
      2. 8.3.2 Measurement Modes: Trigger on Demand vs. Auto Measurement
      3. 8.3.3 Heater
      4. 8.3.4 Interrupt Description
        1. 8.3.4.1 DRDY
      5. 8.3.5 INTERRUPT on Threshold
        1. 8.3.5.1 Temperature High
        2. 8.3.5.2 Temperature Low
        3. 8.3.5.3 Humidity High
        4. 8.3.5.4 Humidity Low
    4. 8.4 Device Functional Modes
      1. 8.4.1 Sleep Mode vs. Measurement Mode
    5. 8.5 Programming
      1. 8.5.1 I2C Serial Bus Address Configuration
      2. 8.5.2 I2C Interface
      3. 8.5.3 Serial Bus Address
      4. 8.5.4 Read and Write Operations
    6. 8.6 Register Maps
      1. 8.6.1  Address 0x00 Temperature LSB
      2. 8.6.2  Address 0x01 Temperature MSB
      3. 8.6.3  Address 0x02 Humidity LSB
      4. 8.6.4  Address 0x03 Humidity MSB
      5. 8.6.5  Address 0x04 Interrupt DRDY
      6. 8.6.6  Address 0x05 Temperature MAX
      7. 8.6.7  Address 0x06 Humidity MAX
      8. 8.6.8  Address 0x07 Interrupt Configuration
      9. 8.6.9  Address 0x08 Temperature Offset Adjustment
      10. 8.6.10 Address 0x09 Humidity Offset Adjustment
      11. 8.6.11 Address 0x0A Temperature Threshold LOW
      12. 8.6.12 Address 0x0B Temperature Threshold HIGH
      13. 8.6.13 Address 0x0C Humidity Threshold LOW
      14. 8.6.14 Address 0x0D Humidity Threshold HIGH
      15. 8.6.15 Address 0x0E Reset and DRDY/INT Configuration Register
      16. 8.6.16 Address 0x0F Measurement Configuration
      17. 8.6.17 Manufacturer ID Low
      18. 8.6.18 Manufacturer ID High
      19. 8.6.19 Device ID Low
      20. 8.6.20 Device ID High
  9. 9  Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 Guidelines for HDC2080 Storage and PCB Assembly
        1. 11.1.1.1 Storage and Handling
        2. 11.1.1.2 Soldering Reflow
        3. 11.1.1.3 Rework
        4. 11.1.1.4 High Temperature and Humidity Exposure
        5. 11.1.1.5 Bake/Re-Hydration Procedure
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
VDD  Applied Voltage on VDD pin –0.3 3.9 V
ADDR Applied Voltage on ADDR pin –0.3 3.9 V
SCL Applied Voltage on SCL pin –0.3 3.9 V
SDA Applied Voltage on SDA pin –0.3 3.9 V
DRDY/INT  Applied Voltage on DRDY/INT PIN -0.3 VDD + 0.3 V
Tstg Storage temperature –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.