10 Revision History
Changes from Revision C (March 2023) to Revision D (November 2024)
- Updated the numbering format for tables, figures, and cross-references throughout the documentGo
- Added thermal pad configuration information to the Pin Configuration and Functions sectionGo
- Added 0% and 100% RH and 80°C data to Figure 6-3
Go
- Changed multiple CRC values in the List of Valid Configuration Values to Override the Default Device Power-On/Reset Measurement State tableGo
- Changed the Soldering Reflow section to add why rehydration is
required for open cavity and protective cover devices and emphasize that all humidity
sensors need rehydration after reflow Go
- Added the recommended operating
range to the Exposure to High Temperature and High Humidity Conditions
section.Go
Changes from Revision B (August 2022) to Revision C (March 2023)
- Changed data sheet status from Production Mixed to Production DataGo
- Removed the preview note from the HDC3022-Q1 deviceGo
Changes from Revision A (September 2021) to Revision B (August 2022)
- Changed data sheet status from Advanced Information to Production MixedGo
- Changed the orderable status on the HDC3020QDEFRQ1 and HDC3021QDEHRQ1 from Advanced Information to Production DataGo
- Added Functional Safety Capable to feature list and linked to additional documentation. Go
- Added wettable flanks package option as product preview.Go
- Renamed drift correct to offset error correctionGo
- Removed that ADDR and ADDR1 pins can be left floating. The pins must NOT be left
floating.Go
- Updated electrical specifications to reflect pre-production testing
characterization.Go
- Added heater commandsGo
- Corrected command code to read Manufacturing ID hex code LSB from: 80 to: 81Go
- Added additional trigger on demand command codes: 0x2C06, 0x2C0D, 0x2C10Go
- Moved the Power Supply Recommendations and Layout sections to the Application and Implementation sectionGo
- Changed rehydration recommendation to 25°C and 50%RH for 5
daysGo