SNAS817D June   2021  – November 2024 HDC3020-Q1 , HDC3021-Q1 , HDC3022-Q1

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Device Comparison
  6. Pin Configuration and Functions
  7. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 I2C Interface Timing
    7. 6.7 Timing Diagram
    8. 6.8 Typical Characteristics
  8. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Factory Installed Polyimide Tape
      2. 7.3.2  Factory Installed IP67 Protection Cover
      3. 7.3.3  Wettable Flanks
      4. 7.3.4  Measurement of Relative Humidity and Temperature
      5. 7.3.5  RH Offset Error Correction: Accuracy Restoration
      6. 7.3.6  NIST Traceability of Relative Humidity and Temperature Sensor
      7. 7.3.7  Measurement Modes: Trigger-On Demand vs Auto Measurement
      8. 7.3.8  Heater
      9. 7.3.9  ALERT Output With Programmable Interrupts
      10. 7.3.10 Checksum Calculation
      11. 7.3.11 Programmable Offset of Relative Humidity and Temperature Results
    4. 7.4 Device Functional Modes
      1. 7.4.1 Sleep Mode vs Measurement Mode
    5. 7.5 Communication
      1. 7.5.1 I2C Interface
      2. 7.5.2 I2C Serial Bus Address Configuration
      3. 7.5.3 I2C Write - Send Device Command
      4. 7.5.4 I2C Read - Retrieve Single Data Result
      5. 7.5.5 I2C Read - Retrieve Multi Data Result
      6. 7.5.6 I2C Repeated START - Send Command and Retrieve Data Results
      7. 7.5.7 Command Table and Detailed Description
        1. 7.5.7.1 Reset
          1. 7.5.7.1.1 Soft Reset
          2. 7.5.7.1.2 I2C General Call Reset
        2. 7.5.7.2 Trigger-On Demand
        3. 7.5.7.3 Auto Measurement Mode
          1. 7.5.7.3.1 Auto Measurement Mode: Enable and Configure Measurement Interval
          2. 7.5.7.3.2 Auto Measurement Mode: Measurement Readout
          3. 7.5.7.3.3 Auto Measurement Mode: Exit
          4. 7.5.7.3.4 Auto Measurement Mode: Extreme Measurement History
          5. 7.5.7.3.5 Override Default Device Power-On and Device-Reset State
        4. 7.5.7.4 ALERT Output Configuration
          1. 7.5.7.4.1 ALERT Output: Environmental Tracking of Temperature and Relative Humidity
          2. 7.5.7.4.2 ALERT Output: Representation of Environmental Thresholds and Default Threshold Values
          3. 7.5.7.4.3 ALERT Output: Steps to Calculate and Program Environmental Thresholds
          4. 7.5.7.4.4 ALERT Output: Deactivation of Environmental Tracking
          5. 7.5.7.4.5 ALERT Output: Transfer Thresholds into Non-Volatile Memory
        5. 7.5.7.5 Programmable Measurement Offset
          1. 7.5.7.5.1 Representation of Offset Value and Factory Shipped Default Value
          2. 7.5.7.5.2 Factory Shipped Default Offset Values
          3. 7.5.7.5.3 Calculate Relative Humidity Offset Value
          4. 7.5.7.5.4 Calculate Temperature Offset Value
          5. 7.5.7.5.5 Program an Offset Value
          6. 7.5.7.5.6 Verify a Programmed Offset Value
        6. 7.5.7.6 Status Register
        7. 7.5.7.7 Heater: Enable and Disable
        8. 7.5.7.8 Heater: Configure Level of Heater Current
        9. 7.5.7.9 Read NIST ID/Serial Number
  9. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
      3. 8.4.3 Storage and PCB Assembly
        1. 8.4.3.1 Storage and Handling
        2. 8.4.3.2 Soldering Reflow
        3. 8.4.3.3 Rework
        4. 8.4.3.4 Exposure to High Temperature and High Humidity Conditions
        5. 8.4.3.5 Bake/Rehydration Procedure
  10. Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DEH|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Electrical Characteristics

TA = -40°C to 125°C, VDD = 1.62V to 5.50V (unless otherwise noted), Typical Specifications are TA = 25°C, VDD = 1.8V unless otherwise noted 
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
Relative Humidity Sensor
RHACC
Accuracy (3)(4) 
TA = 25°C, 10% to 50% RH ±0.5 ±2.0 %RH
TA = 25°C, 0% to 70% RH ±1.0 ±2.0
TA = 25°C, 10% to 80% RH ±1.0 ±2.5
TA = 25°C, 10% to 90% RH ±1.5 ±3.0
TA = 25°C, 0% to 100% RH ±1.5 ±3.5
RHREP  Repeatability(12) Low Power Mode 0 (lowest noise) ±0.02 %RH
Low Power Mode 1 ±0.02
Low Power Mode 2 ±0.03
Low Power Mode 3 (lowest power) ±0.04
RHHYS Hysteresis(5) 10% to 90% RH
±0.8 %RH
RHRT Response Time(6)(7) 10% to 90% RH
t63% step.
4 s
RHLTD Long-term Drift(4)
0.19 %RH/yr
RHPSRR  Supply Sensitivity RH accuiracy VDD = 1.8V to 5.5V –10 1.8 10 %mRH/V
Temperature Sensor
TACC Accuracy
0°C ≤ TA ≤ 50°C
±0.1 ±0.2 °C

-40°C ≤ TA ≤ 100°C
±0.1 ±0.3

-40°C ≤ TA < 125°C
±0.1 ±0.4
TREP  Repeatability(12) Low Power Mode 0 (lowest noise) ±0.04 °C
Low Power Mode 1 ±0.05
Low Power Mode 2 ±0.06
Low Power Mode 3 (lowest power) ±0.08
TRT Response Time (stirred liquid) (6)(13) 25C <TA< 75C
t63% step
Roger's 4350B PCB 1.575mm thickness 
2 s
TLTD Long Term Drift ±0.03 °C/yr
TPSRR  Supply Sensitivity Temperature accuracy –25 -5.7 25 m°C/V
Sensor Timing
tmeas Measurement Duration(8) Low Power Mode 0 (lowest noise) 12.5 14.1 ms
Low Power Mode 1 7.5 8.4
Low Power Mode 2 5.0 5.7
Low Power Mode 3 (lowest power) 3.7 4.2
SCL, SDA Pins
VIL LOW-level input voltage 0.3*VDD V
VIH HIGH-level input voltage 0.7*VDD V
VOL LOW-level output voltage IOL = 3 mA 0.4 V
IIN Input leakage current  SDA and SCL pins –0.5 0.5 µA
CIN Input Capacitance  4.5 pF
Control Pins
VOH High-level Output Voltage - ALERT IOH = -100 µA VDD–0.2 V
High-level Output Voltage - ALERT IOH = -3 mA VDD–0.4 V
VOL Low-level Output Voltage - ALERT IOL = 100 µA 0.2 V
Low-level Output Voltage - ALERT IOL = 3 mA 0.4 V
VIH High Level Input Voltage - ADDR, ADDR1, RESET 0.7*VDD V
VIL Low Level Input Voltage - ADDR, ADDR1, RESET 0.3*VDD V
II Input Leakage Current - ADDR and ADDR1 VI = VDD or GND -0.5 0.5 µA
Power Supply
IDD_ACTIVE Active Current(1) Low Power Mode 0 (lowest noise) 110 170 µA
Low Power Mode 1 108 165
Low Power Mode 2 103 155
Low Power Mode 3 (lowest power) 99 153
Sleep Current(1) No Active Measurement, trigger on demand mode
TA = 25°C
0.36 0.75
IDD_SLEEP No Active Measurement, trigger on demand mode
TA = -40°C to 125°C
14.5 µA
No Active Measurement, auto measurement mode
TA​​​​​​​ = 25°C
0.54 1.05
No Active Measurement, auto measurement mode
TA = -40°C to 125°C
15.0
IDD_AVG_EQN Averaged Current Equation measurement freq = numbers of samples per second see (9)
IDD_AVG Averaged Current(1)(2) trigger on demand mode, low Power Mode 3 (lowest Power)
triggered at 1 sample per second
0.7 µA
trigger on demand mode, low Power Mode 3 (lowest Power)
triggered at 1 sample per 5 seconds
0.4
automeasurement mode, Low Power Mode 0 (lowest noise)
1 sample per second
1.9
automeasurement mode, Low Power Mode 1
1 sample per second
1.3
automeasurement mode, Low Power Mode 2
1 sample per second
1.0
automeasurement mode, low Power Mode 3 (lowest power)
1 sample per second
0.9
automeasurement mode, Low Power Mode 3 (lowest power)
1 sample every two seconds
0.7
PHEATER Heater Power (11) Full Power 0x3FFF, VDD = 3.3V 249 368 mW
Half Power 0x03FF, VDD = 3.3V 137 203
Quarter Power 0x009F, VDD = 3.3V 67 100
VPOR Power on reset threshold voltage supply rising 1.35 V
VBOR Brown out detect voltage supply falling 1.19 V
SensorPUR  Power Up Ready Sensor ready once VDD ≥ 1.62V 3.5 5.0 ms
SensorRR Reset Ready Sensor ready after a reset 1.3 3.0 ms
RRESET RESET pin internal pull up resistance 49 kΩ
tRESET_NPW Negative pulse width to trigger hard reset 1 µS
EEPROM (T, RH offset, and alert)
OSEND Program Endurance 1000 50000 Cycles
OSRET Data Retention Time 100% Power-On hours 10 100 Years
tPROG EEPROM Programming Time 53 77 ms
IEEPROM EEPROM write quiescent current No active measurement; serial bus inactive  525 µA
Does not include I2C read/write communication or pullup resistor current through SCL and SDA
Average current consumption while conversion is in progress
Excludes hysteresis and long-term drift
Based on THB (temperature humidity bias) testing using Arrhenius-Peck acceleration model. Excludes the impact of dust, gas phase solvents and other contaminents such as vapors from packaging materials, adhesives, or tapes, and more. 
The hysteresis value is the difference between the RH measurement in a rising and falling RH environment, at a specific RH point
Actual response times varies dependent on system thermal mass and air-flow
Time for the RH output to change by 63% of the total RH change after a step change in environmental humidity
Measurement duration includes the time to measure RH plus Temp
IDD_AVG_EQN = measurement freq x IDD_ACTIVE x tmeas+ Isleep x (1- (measurement freq x tmeas));
verify that units match, for example, that measurement frequency in Hz, tmeas in seconds, and all the currents in the same unit
Time for the T output to change by 63% of the total T change after a step change in environmental temperature
More details on the heater can be found in the HDC3x Silicon User's Guide
Typical Values are a 3-sigma measurement over both temperature and supply voltage.