SBOS027C
September 2000 – September 2022
INA118
PRODUCTION DATA
1
Features
2
Applications
3
Description
4
Revision History
5
Device Comparison Table
6
Pin Configuration and Functions
7
Specifications
7.1
Absolute Maximum Ratings
7.2
ESD Ratings
7.3
Recommended Operating Conditions
7.4
Thermal Information
7.5
Electrical Characteristics
7.6
Typical Characteristics
8
Detailed Description
8.1
Overview
8.2
Functional Block Diagram
8.3
Feature Description
8.4
Device Functional Modes
8.4.1
Noise Performance
8.4.2
Input Common-Mode Range
8.4.3
Input Protection
9
Application and Implementation
9.1
Application Information
9.2
Typical Application
9.2.1
Design Requirements
9.2.2
Detailed Design Procedure
9.2.2.1
Setting the Gain
9.2.2.2
Dynamic Performance
9.2.2.3
Offset Trimming
9.2.2.4
Input Bias Current Return Path
9.2.3
Application Curves
9.3
Power Supply Recommendations
9.3.1
Low-Voltage Operation
9.3.2
Single-Supply Operation
9.4
Layout
9.4.1
Layout Guidelines
9.4.2
Layout Example
10
Device and Documentation Support
10.1
Device Support
10.1.1
Development Support
10.2
Receiving Notification of Documentation Updates
10.3
Support Resources
10.4
Trademarks
10.5
Electrostatic Discharge Caution
10.6
Glossary
11
Mechanical, Packaging, and Orderable Information
Package Options
Mechanical Data (Package|Pins)
D|8
MSOI002K
P|8
MPDI001B
Thermal pad, mechanical data (Package|Pins)
Orderable Information
sbos027c_oa
sbos027c_pm
7.2
ESD Ratings
VALUE
UNIT
V
(ESD)
Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001
(1)
±1000
V
Charged-device model (CDM), per JEDEC specification JESD22-C101
(2)
±500
(1)
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2)
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.