Attention to good layout practices is always recommended. For best operational performance of the device, use good printed circuit board (PCB) layout practices, including:
- Make sure that both input paths are well-matched
for source impedance and capacitance to avoid converting common-mode signals
into differential signals. In addition, parasitic capacitance at the
gain-setting pins can also affect CMRR over frequency. For example, in
applications that implement gain switching using switches or PhotoMOS® relays to
change the value of RG, select the component so that the switch
capacitance is as small as possible.
- Connect low-ESR,
0.1-μF ceramic bypass capacitors between each supply pin and ground,
placed as close to the device as possible. A single bypass capacitor
from V+ to ground is applicable for single-supply applications.
- Separate grounding for analog and digital
portions of the circuitry is one of the simplest and most effective methods
of noise suppression. One or more layers on multilayer PCBs are usually
devoted to ground planes. A ground plane helps distribute heat and reduces
EMI noise pickup. Make sure to physically separate digital and analog
grounds, paying attention to the flow of the ground current. For more
detailed information, see PCB Design Guidelines For Reduced
EMI.
- In order to reduce parasitic coupling, run the input traces as far away from the supply or output traces as possible. If these traces cannot be kept separate, crossing the sensitive trace perpendicular is much better than in parallel with the noisy trace.
- Place the external components as close to the
device as possible. As illustrated in Figure 10-1, keep RG close to the pins to minimize parasitic
capacitance.
- Keep the traces as short as possible