SBOS052A september   2000  – august 2023 INA141

PRODUCTION DATA  

  1.   1
  2. 1Features
  3. 2Applications
  4. 3Description
  5. 4Revision History
  6. 5Pin Configuration and Functions
  7. 6Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  8. 7Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Setting the Gain
      2. 7.1.2 Dynamic Performance
      3. 7.1.3 Noise Performance
      4. 7.1.4 Offset Trimming
      5. 7.1.5 Input Bias Current Return Path
      6. 7.1.6 Input Common-Mode Range
      7. 7.1.7 Low-Voltage Operation
      8. 7.1.8 Input Protection
  9. 8Device and Documentation Support
    1. 8.1 Receiving Notification of Documentation Updates
    2. 8.2 Support Resources
    3. 8.3 Trademarks
    4. 8.4 Electrostatic Discharge Caution
    5. 8.5 Glossary
  10. 9Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

THERMAL METRIC(1) INA141 UNIT
D (SOIC)
8 PINS
θJA Junction-to-ambient thermal resistance 150 °C/W
RθJA Junction-to-ambient thermal resistance 110 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 57 °C/W
RθJB Junction-to-board thermal resistance 54 °C/W
ψJT Junction-to-top characterization parameter 11 °C/W
ψJB Junction-to-board characterization parameter 53 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.