SBOS859B March   2018  – July 2018 INA1620

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      INA1620 Simplified Internal Schematic
      2.      FFT: 1 kHz, 32-Ω Load, 50 mW
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics:
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Matched Thin-Film Resistor Pairs
      2. 7.3.2 Power Dissipation
      3. 7.3.3 Thermal Shutdown
      4. 7.3.4 EN Pin
      5. 7.3.5 GND Pin
      6. 7.3.6 Input Protection
    4. 7.4 Device Functional Modes
      1. 7.4.1 Shutdown Mode
      2. 7.4.2 Output Transients During Power Up and Power Down
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Noise Performance
      2. 8.1.2 Resistor Tolerance
      3. 8.1.3 EMI Rejection
      4. 8.1.4 EMIRR +IN Test Configuration
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Other Application Examples
      1. 8.3.1 Preamplifier for Professional Microphones
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
        1. 11.1.1.1 TINA-TI (Free Software Download)
        2. 11.1.1.2 TI Precision Designs
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Community Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

10.1 Layout Guidelines

For best operational performance of the device, use good printed circuit board (PCB) layout practices, including:

  • Connect low-ESR, 0.1-µF ceramic bypass capacitors between each supply pin and ground, placed as close as possible to the device. A single bypass capacitor from V+ to ground is applicable for single-supply applications. The bypass capacitors are used to reduce the coupled noise by providing low-impedance power sources local to the analog circuitry, because noise can propagate into analog circuitry through the power pins of the circuit as a whole and the op amp specifically.
  • Connect the device ground pin to a low-impedance, low-noise, system reference point, such as an analog ground.
  • Place the external components as close to the device as possible. As shown in Figure 61, keep feedback resistors close to the inverting input to minimize parasitic capacitance and the feedback loop area.
  • Keep the length of input traces as short as possible. Always remember that the input traces are the most sensitive part of the circuit.
  • For proper amplifier function, connect the package thermal pad to the most negative supply voltage (VEE).