SBOS122E December   1999  – December 2017 INA138 , INA168

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Output Voltage Range
      2. 7.3.2 Bandwidth
    4. 7.4 Device Functional Modes
  8. Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Operation
    2. 8.2 Typical Applications
      1. 8.2.1 Buffering Output to Drive an ADC
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Selecting the Shunt Resistor and RL
        3. 8.2.1.3 Application Curve
      2. 8.2.2 Output Filter
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
        3. 8.2.2.3 Application Curve
      3. 8.2.3 Offsetting the Output Voltage
      4. 8.2.4 Bipolar Current Measurement
      5. 8.2.5 Bipolar Current Measurement Using Differential Input of ADC
      6. 8.2.6 Multiplexed Measurement Using Logic Signal for Power
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Related Links
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Community Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Layout

Layout Guidelines

Figure 19 shows the basic connection of the INA138 device. The input pins, VIN+ and VIN– , should be connected as closely as possible to the shunt resistor to minimize any resistance in series with the shunt resistance. The output resistor, RL, is shown connected between pin 1 and ground. Best accuracy is achieved with the output voltage measured directly across RL. This is especially important in high-current systems where load current could flow in the ground connections, affecting the measurement accuracy.

No power-supply bypass capacitors are required for stability of the INA138. However, applications with noisy or high-impedance power supplies may require decoupling capacitors to reject power-supply noise. Connect bypass capacitors close to the device pins.

Layout Example

INA138 INA168 INA138_PCB_LAYOUT.gif Figure 19. Typical Layout Example