SBOS318B April   2019  – July 2021 INA186

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Precision Current Measurement
      2. 7.3.2 Low Input Bias Current
      3. 7.3.3 Low Quiescent Current With Output Enable
      4. 7.3.4 Bidirectional Current Monitoring
      5. 7.3.5 High-Side and Low-Side Current Sensing
      6. 7.3.6 High Common-Mode Rejection
      7. 7.3.7 Rail-to-Rail Output Swing
    4. 7.4 Device Functional Modes
      1. 7.4.1 Normal Operation
      2. 7.4.2 Unidirectional Mode
      3. 7.4.3 Bidirectional Mode
      4. 7.4.4 Input Differential Overload
      5. 7.4.5 Shutdown
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Basic Connections
      2. 8.1.2 RSENSE and Device Gain Selection
      3. 8.1.3 Signal Conditioning
      4. 8.1.4 Common-Mode Voltage Transients
    2. 8.2 Typical Applications
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Examples
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DDF|8
  • YFD|6
  • DCK|6
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5 Pin Configuration and Functions

Figure 5-1 DCK Package6-Pin SC70Top View
Figure 5-3 DDF Package8-Pin SOT-23Top View
Figure 5-2 YFD Package6-Pin DSBGA Top View
Table 5-1 Pin Functions
PIN TYPE DESCRIPTION
NAME DCK
(SC70)		 DDF
(SOT-23)		 YFD
(DSBGA)
ENABLE — 2 B3 Digital input Enable Pin. When this pin is driven to VS, the device is on and functions as a current sense amplifier. When this pin is driven to GND, the device is off, the supply current is reduced, and the output is placed in a high-impedance state. This pin must be driven externally, or connected to VS if not used. DDF and YFD packages only.
GND 2 4 B2 Analog Ground
IN– 5 8 B1 Analog input Current-sense amplifier negative input. For high-side applications, connect to load side of sense resistor. For low-side applications, connect to ground side of sense resistor.
IN+ 4 7 A1 Analog input Current-sense amplifier positive input. For high-side applications, connect to bus voltage side of sense resistor. For low-side applications, connect to load side of sense resistor.
NC — 6 — — No internal connection. Can be left floating, grounded, or connected to supply.
OUT 6 5 A3 Analog output OUT pin. This pin provides an analog voltage output that is the gained up voltage difference from the IN+ to the IN– pins, and is offset by the voltage applied to the REF pin.
REF 1 3 — Analog input Reference input. Enables bidirectional current sensing with an externally applied voltage. DCK and DDF packages only. Devices without a REF pin have the REF node grounded internally.
VS 3 1 A2 Analog Power supply, 1.7 V to 5.5 V