SBOS632 September   2015 INA188

UNLESS OTHERWISE NOTED, this document contains PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics: VS = ±4 V to ±18 V (VS = 8 V to 36 V)
    6. 6.6 Electrical Characteristics: VS = ±2 V to < ±4 V (VS = 4 V to < 8 V)
    7. 6.7 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Inside the INA188
      2. 7.3.2 Setting the Gain
        1. 7.3.2.1 Gain Drift
      3. 7.3.3 Zero Drift Topology
        1. 7.3.3.1 Internal Offset Correction
        2. 7.3.3.2 Noise Performance
        3. 7.3.3.3 Input Bias Current Clock Feedthrough
      4. 7.3.4 EMI Rejection
      5. 7.3.5 Input Protection and Electrical Overstress
      6. 7.3.6 Input Common-Mode Range
    4. 7.4 Device Functional Modes
      1. 7.4.1 Single-Supply Operation
      2. 7.4.2 Offset Trimming
      3. 7.4.3 Input Bias Current Return Path
      4. 7.4.4 Driving the Reference Pin
      5. 7.4.5 Error Sources Example
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

11 Device and Documentation Support

11.1 Device Support

11.1.1 Development Support

Table 4. Table 1. Design Kits and Evaluation Modules

NAME PART NUMBER TYPE
DIP Adapter Evaluation Module DIP-ADAPTER-EVM Evaluation Module and Boards
Universal Instrumentation Amplifier Evaluation Module INAEVM Evaluation Module and Boards

Table 5. Table 2. Development Tools

NAME PART NUMBER TYPE
Calculate Input Common-Mode Range of Instrumentation Amplifiers INA-CMV-CALC Calculation Tools
SPICE-Based Analog Simulation Program TINA-TI Circuit Design and Simulation

11.2 Documentation Support

11.2.1 Related Documentation

OPA188 Data Sheet, SBOS642

OPA330 Data Sheet, SBOS432

REF3225 Data Sheet, SBVS058

Circuit Board Layout Techniques, SLOA089

11.3 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

11.4 Trademarks

E2E is a trademark of Texas Instruments.

Bluetooth is a registered trademark of Bluetooth SIG, Inc.

PhotoMOS is a registered trademark of Panasonic Electric Works Europe AG.

All other trademarks are the property of their respective owners.

11.5 Electrostatic Discharge Caution

esds-image

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

11.6 Glossary

SLYZ022TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.