SBOSA74 May   2022 INA190-EP

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Precision Current Measurement
      2. 7.3.2 Low Input Bias Current
      3. 7.3.3 Low Quiescent Current With Output Enable
      4. 7.3.4 Bidirectional Current Monitoring
      5. 7.3.5 High-Side and Low-Side Current Sensing
      6. 7.3.6 High Common-Mode Rejection
      7. 7.3.7 Rail-to-Rail Output Swing
    4. 7.4 Device Functional Modes
      1. 7.4.1 Normal Operation
      2. 7.4.2 Unidirectional Mode
      3. 7.4.3 Bidirectional Mode
      4. 7.4.4 Input Differential Overload
      5. 7.4.5 Shutdown
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Basic Connections
      2. 8.1.2 RSENSE and Device Gain Selection
      3. 8.1.3 Signal Conditioning
      4. 8.1.4 Common-Mode Voltage Transients
    2. 8.2 Typical Applications
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Examples
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5 Pin Configuration and Functions

Figure 5-1 DDF Package8-Pin Thin SOT-23(Top View)
Table 5-1 Pin Functions
PIN TYPE DESCRIPTION
NAME NO.
ENABLE 2 Digital input Enable pin. When this pin is driven to VS, the device is on and functions as a current-sense amplifier. When this pin is driven to GND, the device is off, the supply current is reduced, and the output is placed in a high-impedance state. This pin must be driven externally, or connected to VS if not used.
GND 4 Analog Ground
IN– 8 Analog input Current-sense amplifier negative input. For high-side applications, connect the to load side of the sense resistor. For low-side applications, connect to the ground side of the sense resistor.
IN+ 7 Analog input Current-sense amplifier positive input. For high-side applications, connect to the bus voltage side of the sense resistor. For low-side applications, connect to the load side of the sense resistor.
NC 6 — Not internally connected. Either float these pins or connect to any voltage between GND and VS.
OUT 5 Analog output OUT pin. This pin provides an analog voltage output that is the gained-up voltage difference from the IN+ to the IN– pins, and is offset by the voltage applied to the REF pin.
REF 3 Analog input Reference input. Enables bidirectional current sensing with an externally applied voltage.
VS 1 Analog Power supply, 1.7 V to 5.5 V