SBOS437K May   2008  – November 2023 INA210 , INA211 , INA212 , INA213 , INA214 , INA215

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configurations and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Basic Connections
      2. 6.3.2 Selecting RS
    4. 6.4 Device Functional Modes
      1. 6.4.1 Input Filtering
      2. 6.4.2 Shutting Down the INA21x Series
      3. 6.4.3 REF Input Impedance Effects
      4. 6.4.4 Using The INA21x With Common-Mode Transients Above 26 V
      5. 6.4.5 Improving Transient Robustness
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Applications
      1. 7.2.1 Unidirectional Operation
        1. 7.2.1.1 Design Requirements
        2. 7.2.1.2 Detailed Design Procedure
        3. 7.2.1.3 Application Curve
      2. 7.2.2 Bidirectional Operation
        1. 7.2.2.1 Design Requirements
        2. 7.2.2.2 Detailed Design Procedure
        3. 7.2.2.3 Application Curve
  9. 8 Power Supply Recommendations
  10. 9 Layout
    1. 9.1 Layout Guidelines
    2. 9.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Related Links
    3. 10.3 Receiving Notification of Documentation Updates
    4. 10.4 Support Resources
    5. 10.5 Trademarks
    6. 10.6 Electrostatic Discharge Caution
    7. 10.7 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.4 Thermal Information

THERMAL METRIC(1)INA21xUNIT
DCK (SC70)RSW (UQFN)
6 PINS10 PINS
RθJAJunction-to-ambient thermal resistance227.3107.3°C/W
RθJC(top)Junction-to-case (top) thermal resistance79.556.5°C/W
RθJBJunction-to-board thermal resistance72.118.7°C/W
ψJTJunction-to-top characterization parameter3.61.1°C/W
ψJBJunction-to-board characterization parameter70.418.7°C/W
RθJC(bot)Junction-to-case (bottom) thermal resistanceN/AN/A°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.