SLYS018F April   2018  – October 2024 INA181-Q1 , INA2181-Q1 , INA4181-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagrams
    3. 7.3 Feature Description
      1. 7.3.1 High Bandwidth and Slew Rate
      2. 7.3.2 Bidirectional Current Monitoring
      3. 7.3.3 Wide Input Common-Mode Voltage Range
      4. 7.3.4 Precise Low-Side Current Sensing
      5. 7.3.5 Rail-to-Rail Output Swing
    4. 7.4 Device Functional Modes
      1. 7.4.1 Normal Mode
      2. 7.4.2 Unidirectional Mode
      3. 7.4.3 Bidirectional Mode
      4. 7.4.4 Input Differential Overload
      5. 7.4.5 Shutdown Mode
  9. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Basic Connections
      2. 8.1.2 RSENSE and Device Gain Selection
      3. 8.1.3 Signal Filtering
      4. 8.1.4 Summing Multiple Currents
      5. 8.1.5 Detecting Leakage Currents
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
    3. 8.3 Power Supply Recommendations
      1. 8.3.1 Common-Mode Transients Greater Than 26 V
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Development Support
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation
    3. 9.3 Receiving Notification of Documentation Updates
    4. 9.4 Support Resources
    5. 9.5 Trademarks
    6. 9.6 Electrostatic Discharge Caution
    7. 9.7 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DGS|10
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.2.1 Design Requirements

The design requirements for the circuit shown in Figure 8-7, are listed in Table 8-3.

Table 8-3 Design Parameters
DESIGN PARAMETEREXAMPLE VALUE
Power-supply voltage, VS5 V
Bus supply rail, VCM12 V
RSENSE power loss< 450 mW
Maximum sense current, IMAX±20 A
Current sensing errorLess than 3.5% at maximum current, TJ = 25°C
Small-signal bandwidth> 100 kHz