SBOS547B June   2011  – September 2024 INA226

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Basic ADC Functions
        1. 6.3.1.1 Power Calculation
        2. 6.3.1.2 Alert Pin
    4. 6.4 Device Functional Modes
      1. 6.4.1 Averaging and Conversion Time Considerations
      2. 6.4.2 Filtering and Input Considerations
    5. 6.5 Programming
      1. 6.5.1 Programming the Calibration Register
      2. 6.5.2 Programming the Power Measurement Engine
        1. 6.5.2.1 Calibration Register and Scaling
      3. 6.5.3 Simple Current Shunt Monitor Usage (No Programming Necessary)
      4. 6.5.4 Default Settings
      5. 6.5.5 Bus Overview
        1. 6.5.5.1 Serial Bus Address
        2. 6.5.5.2 Serial Interface
        3. 6.5.5.3 Writing to and Reading From the INA226
          1. 6.5.5.3.1 High-Speed I2C Mode
        4. 6.5.5.4 SMBus Alert Response
  8. 7 Registers
    1. 7.1 Register Maps
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 High-Side Sensing Circuit Application
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Development Support
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

10 Revision History

Changes from Revision A (August 2015) to Revision B (September 2024)

  • Updated the number formatting for tables, figures, and cross-references throughout the documentGo
  • Removed Machine Model from ESD RatingsGo
  • Updated thermal metric values to match thermal modelGo
  • Added ± in front of typical values for PSRR specificationsGo
  • Decreased input bias current typical valueGo
  • Updated Shunt Input Gain Error vs Common-Mode Voltage graph and Input Bias current curvesGo

Changes from Revision * (June 2011) to Revision A (August 2015)

  • Added Handling Rating table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information sectionGo