SBOS644D February   2013  – July 2022 INA231

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements: I2C Bus
    7. 7.7 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Basic Analog-to-Digital Converter (ADC) Functions
        1. 8.3.1.1 Power Calculation
        2. 8.3.1.2 ALERT Pin
    4. 8.4 Device Functional Modes
      1. 8.4.1 Averaging and Conversion Time Considerations
    5. 8.5 Programming
      1. 8.5.1 Configure, Measure, and Calculate Example
      2. 8.5.2 Programming the Power Measurement Engine
        1. 8.5.2.1 Calibration Register and Scaling
      3. 8.5.3 Simple Current Shunt Monitor Usage (No Programming Necessary)
      4. 8.5.4 Default INA231 Settings
      5. 8.5.5 Writing to and Reading from the INA231
        1. 8.5.5.1 Bus Overview
          1. 8.5.5.1.1 Serial Bus Address
          2. 8.5.5.1.2 Serial Interface
        2. 8.5.5.2 High-Speed I2C Mode
      6. 8.5.6 SMBus Alert Response
    6. 8.6 Register Maps
      1. 8.6.1 Configuration Register (00h, Read/Write)
        1. 8.6.1.1 AVG Bit Settings [11:9]
        2. 8.6.1.2 VBUS CT Bit Settings [8:6]
        3. 8.6.1.3 VSH CT Bit Settings [5:3]
        4. 8.6.1.4 Mode Settings [2:0]
      2. 8.6.2 Shunt Voltage Register (01h, Read-Only)
      3. 8.6.3 Bus Voltage Register (02h, Read-Only)
      4. 8.6.4 Power Register (03h, Read-Only)
      5. 8.6.5 Current Register (04h, Read-Only)
      6. 8.6.6 Calibration Register (05h, Read/Write)
      7. 8.6.7 Mask/Enable Register (06h, Read/Write)
      8. 8.6.8 Alert Limit Register (07h, Read/Write)
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Filtering and Input Considerations
    2. 9.2 Typical Applications
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  10. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  11. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • YFF|12
  • YFD|12
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9.2.3 Application Curves

Figure 9-4 shows the ALERT pin response to a shunt overvoltage of 50 mV for a conversion time (tCT) of 140 μs. and averaging set to 1. Figure 9-5 shows the response for the same limit, but with the conversion time reduced to 1.1 ms.

GUID-3E35D4F8-5C19-4108-854F-7BE3C5F3725C-low.gif
Configuration register = 4005h
Mask/Enable register = 8008h
Alert Limit register = 4E20h,
tCT = 140 µs
Figure 9-4 Alert Response
GUID-2082DD7D-D72D-44AB-AD84-8FC03F2E04CE-low.gif
Configuration register = 4125h
Mask/Enable register = 8008h
Alert Limit register = 4E20h,
tCT = 1.1 ms
Figure 9-5 Alert Response