SBOS644D February   2013  – July 2022 INA231

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements: I2C Bus
    7. 7.7 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Basic Analog-to-Digital Converter (ADC) Functions
        1. 8.3.1.1 Power Calculation
        2. 8.3.1.2 ALERT Pin
    4. 8.4 Device Functional Modes
      1. 8.4.1 Averaging and Conversion Time Considerations
    5. 8.5 Programming
      1. 8.5.1 Configure, Measure, and Calculate Example
      2. 8.5.2 Programming the Power Measurement Engine
        1. 8.5.2.1 Calibration Register and Scaling
      3. 8.5.3 Simple Current Shunt Monitor Usage (No Programming Necessary)
      4. 8.5.4 Default INA231 Settings
      5. 8.5.5 Writing to and Reading from the INA231
        1. 8.5.5.1 Bus Overview
          1. 8.5.5.1.1 Serial Bus Address
          2. 8.5.5.1.2 Serial Interface
        2. 8.5.5.2 High-Speed I2C Mode
      6. 8.5.6 SMBus Alert Response
    6. 8.6 Register Maps
      1. 8.6.1 Configuration Register (00h, Read/Write)
        1. 8.6.1.1 AVG Bit Settings [11:9]
        2. 8.6.1.2 VBUS CT Bit Settings [8:6]
        3. 8.6.1.3 VSH CT Bit Settings [5:3]
        4. 8.6.1.4 Mode Settings [2:0]
      2. 8.6.2 Shunt Voltage Register (01h, Read-Only)
      3. 8.6.3 Bus Voltage Register (02h, Read-Only)
      4. 8.6.4 Power Register (03h, Read-Only)
      5. 8.6.5 Current Register (04h, Read-Only)
      6. 8.6.6 Calibration Register (05h, Read/Write)
      7. 8.6.7 Mask/Enable Register (06h, Read/Write)
      8. 8.6.8 Alert Limit Register (07h, Read/Write)
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Filtering and Input Considerations
    2. 9.2 Typical Applications
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  10. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  11. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • YFF|12
  • YFD|12
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from Revision C (March 2018) to Revision D (July 2022)

  • Updated the numbering format for tables, figures, and cross-references throughout the documentGo
  • Added footnote to B2 and C2 pinsGo
  • Changed value from 40 ms to 40 µs in sentence: Full recovery from power-down mode requires 40 µsGo
  • Moved the Power Supply Recommendations and Layout sections to the Application and Implementation sectionGo

Changes from Revision B (August 2017) to Revision C (March 2018)

  • Added B version device and associated content Go

Changes from Revision A (June 2017) to Revision B (August 2017)

  • Changed NC pin description from "No internal connection" to "Do not connect, leave floating" Go
  • Changed SCL max value from VS + 0.3 V to 6 V in Absolute Maximum Ratings tableGo
  • Added text to end of Layout Guidelines section clarifying no connection of NC pinsGo

Changes from Revision * (February 2013) to Revision A (June 2017)

  • Added Device Information, Recommended Operating Conditions, and ESD Ratings tables, and Detailed Description , Application and Implementation, Power Supply Recommendations, Layout, Device and Documentation Support , and Mechanical, Packaging, and Orderable Information sectionsGo
  • Added new WSCP-12 (YFD) package with 0.4-mm package height and associated content to data sheetGo
  • Added operating ambient temperature, TA to Absolute Maximum Ratings tableGo
  • Added new note 1 to Timing Requirements: I2C Bus section Go
  • Added test condition to Figure 2 Go