SBOSA81D may   2021  – august 2023 INA236

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements (I2C)
    7. 6.7 Timing Diagram
    8. 6.8 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Integrated Analog-to-Digital Convertor (ADC)
      2. 7.3.2 Power Calculation
      3. 7.3.3 Low Bias Current
      4. 7.3.4 Low Voltage Supply and Wide Common-Mode Voltage Range
      5. 7.3.5 ALERT Pin
    4. 7.4 Device Functional Modes
      1. 7.4.1 Continuous Verses Triggered Operation
      2. 7.4.2 Device Shutdown
      3. 7.4.3 Power-On Reset
      4. 7.4.4 Averaging and Conversion Time Considerations
    5. 7.5 Programming
      1. 7.5.1 I2C Serial Interface
      2. 7.5.2 Writing to and Reading Through the I2C Serial Interface
      3. 7.5.3 High-Speed I2C Mode
      4. 7.5.4 General Call Reset
      5. 7.5.5 General Call Start Byte
      6. 7.5.6 SMBus Alert Response
    6. 7.6 Register Maps
      1. 7.6.1 Device Registers
  9. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Device Measurement Range and Resolution
      2. 8.1.2 Current and Power Calculations
      3. 8.1.3 ADC Output Data Rate and Noise Performance
      4. 8.1.4 Filtering and Input Considerations
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Select the Shunt Resistor
        2. 8.2.2.2 Configure the Device
        3. 8.2.2.3 Program the Shunt Calibration Register
        4. 8.2.2.4 Set Desired Fault Thresholds
        5. 8.2.2.5 Calculate Returned Values
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Development Support
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation
    3. 9.3 Receiving Notification of Documentation Updates
    4. 9.4 Support Resources
    5. 9.5 Trademarks
    6. 9.6 Electrostatic Discharge Caution
    7. 9.7 Glossary
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DDF|8
  • YBJ|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.2.2.5 Calculate Returned Values

Table 8-4 below shows the register values assuming the design requirements shown in Table 8-3. User programmed values for the Configuration, Calibration, Mask/Enable and Alert limit registers are shown, as well as, the returned values for shunt voltage, current, bus voltage and power. Parametric values are calculated by multiplying the returned value by the LSB value.

Table 8-4 Calculate Returned Values
Register Contents LSB Value Calculated Value
Configuration (0h) 16679d (4127h) — —
Calibration (5h) 1280d (500h) — —
Mask/Enable (6h) 32768 (8000h) — —
Alert Limit (7h) 28800d (7080h) 2.5 μV/LSB 28800 × 2.5 μV = 0.072 V
Shunt Voltage (1h) 19200d (4B00h) 2.5 µV/LSB 19200 × 2.5 μV = 0.048 V
Bus Voltage (2h) 7500d (1D4Ch) 1.6 mV/LSB 7500 × 1.6 mV = 12 V
Current (4h) 12000d (2EE0h) 500 µA/LSB 12000 × 500 µA = 6 A
Power (3h) 4500d (1194h) Current LSB x 32 = 16 mW/LSB 4500 × 16 mW = 72 W

Shunt Voltage and Current return values in two's complement format. In two's complement format a negative value in binary is represented by having a 1 in the most significant bit of the returned value. These values can be converted to decimal by first inverting all the bits and adding 1 to obtain the unsigned binary value. This value should then be converted to decimal with the negative sign applied.