4 Revision History
Changes from Revision D (April 2020) to Revision E (December 2021)
- Changed the SOIC package size from 4.00 mm × 3.91 mm to 4.90 mm ×
3.91 mm in the Device Information table Go
- Added or left unconnected to the NC pin in the Pin Functions
table Go
- Changed the reference design guide link in the Related
Documentation sectionGo
Changes from Revision C (November 2018) to Revision D (April 2020)
- Added Functional Safety-Capable informationGo
Changes from Revision B (December 2017) to Revision C (November 2018)
- Changed document status from Mixed Status to Production Data Go
- Added temperature Grade-0 devices to data sheet Go
- Changed TSSOP package status from preview to production data Go
- Deleted package preview note from 8-pin TSSOP package pinout drawing in Pin Configuration and Functions sectionGo
- Deleted package preview note from Thermal Information table Go
Changes from Revision A (December 2016) to Revision B (December 2017)
- Changed document status from Product Preview to Mixed StatusGo
- Added Description (cont.) section Go
- Added preview label to 8-pin TSSOP packageGo
- Changed y-axis values in Figure 7-15
Go
- Added Figure 11-2
Go
Changes from Revision * (August 2016) to Revision A (December 2016)
- Added 8-pin D (SOIC) package for the INA240-Q1 Grade 0 and Grade 1 device Go
- Added thermal values for the D (SOIC) package in the Thermal Information table Go