SBOS808E August   2016  – December 2021 INA240-Q1

PRODUCTION DATA  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Device Comparison
  6. Pin Configuration and Functions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Amplifier Input Signal
        1. 8.3.1.1 Enhanced PWM Rejection Operation
        2. 8.3.1.2 Input Signal Bandwidth
      2. 8.3.2 Selecting the Sense Resistor (RSENSE)
    4. 8.4 Device Functional Modes
      1. 8.4.1 Adjusting the Output Midpoint With the Reference Pins
      2. 8.4.2 Reference Pin Connections for Unidirectional Current Measurements
        1. 8.4.2.1 Ground Referenced Output
        2. 8.4.2.2 VS Referenced Output
      3. 8.4.3 Reference Pin Connections for Bidirectional Current Measurements
        1. 8.4.3.1 Output Set to External Reference Voltage
        2. 8.4.3.2 Output Set to Midsupply Voltage
        3. 8.4.3.3 Output Set to Mid-External Reference
        4. 8.4.3.4 Output Set Using Resistor Divider
      4. 8.4.4 Calculating Total Error
        1. 8.4.4.1 Error Sources
        2. 8.4.4.2 Reference Voltage Rejection Ratio Error
          1. 8.4.4.2.1 Total Error Example 1
          2. 8.4.4.2.2 Total Error Example 2
  9. Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Input Filtering
    2. 9.2 Typical Applications
      1. 9.2.1 Inline Motor Current-Sense Application
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curve
      2. 9.2.2 Solenoid Drive Current-Sense Application
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
        3. 9.2.2.3 Application Curve
    3. 9.3 What to Do and What Not to Do
      1. 9.3.1 High-Precision Applications
      2. 9.3.2 Kelvin Connection from the Current-Sense Resistor
  10. 10Power Supply Recommendations
    1. 10.1 Power Supply Decoupling
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 Connection to the Current-Sense Resistor
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Revision History

Changes from Revision D (April 2020) to Revision E (December 2021)

  • Changed the SOIC package size from 4.00 mm × 3.91 mm to 4.90 mm × 3.91 mm in the Device Information table Go
  • Added or left unconnected to the NC pin in the Pin Functions table Go
  • Changed the reference design guide link in the Related Documentation sectionGo

Changes from Revision C (November 2018) to Revision D (April 2020)

  • Added Functional Safety-Capable informationGo

Changes from Revision B (December 2017) to Revision C (November 2018)

  • Changed document status from Mixed Status to Production Data Go
  • Added temperature Grade-0 devices to data sheet Go
  • Changed TSSOP package status from preview to production data Go
  • Deleted package preview note from 8-pin TSSOP package pinout drawing in Pin Configuration and Functions sectionGo
  • Deleted package preview note from Thermal Information table Go

Changes from Revision A (December 2016) to Revision B (December 2017)

  • Changed document status from Product Preview to Mixed StatusGo
  • Added Description (cont.) section Go
  • Added preview label to 8-pin TSSOP packageGo
  • Changed y-axis values in Figure 7-15 Go
  • Added Figure 11-2 Go

Changes from Revision * (August 2016) to Revision A (December 2016)

  • Added 8-pin D (SOIC) package for the INA240-Q1 Grade 0 and Grade 1 device Go
  • Added thermal values for the D (SOIC) package in the Thermal Information table Go