SBOSA30C March   2022  – October 2023 INA241A , INA241B

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Device Comparison
  7. 6 Pin Configuration and Functions
  8. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Amplifier Input Common-Mode Signal
        1. 8.3.1.1 Enhanced PWM Rejection Operation
        2. 8.3.1.2 Input-Signal Bandwidth
        3. 8.3.1.3 Low Input Bias Current
        4. 8.3.1.4 Low VSENSE Operation
        5. 8.3.1.5 Wide Fixed Gain Output
        6. 8.3.1.6 Wide Supply Range
    4. 8.4 Device Functional Modes
      1. 8.4.1 Adjusting the Output With the Reference Pins
      2. 8.4.2 Reference Pin Connections for Unidirectional Current Measurements
        1. 8.4.2.1 Ground Referenced Output
        2. 8.4.2.2 VS Referenced Output
      3. 8.4.3 Reference Pin Connections for Bidirectional Current Measurements
        1. 8.4.3.1 Output Set to External Reference Voltage
        2. 8.4.3.2 Output Set to Mid-Supply Voltage
        3. 8.4.3.3 Output Set to Mid-External Reference
        4. 8.4.3.4 Output Set Using Resistor Divider
      4. 8.4.4 High Signal Throughput
  10. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 RSENSE and Device Gain Selection
    2. 9.2 Typical Application
      1. 9.2.1 Inline Motor Current-Sense Application
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curve
    3. 9.3 Power Supply Recommendations
      1. 9.3.1 Power Supply Decoupling
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Examples
  11. 10Device and Documentation Support
    1. 10.1 Receiving Notification of Documentation Updates
    2. 10.2 Support Resources
    3. 10.3 Trademarks
    4. 10.4 Electrostatic Discharge Caution
    5. 10.5 Glossary
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

10.4 Electrostatic Discharge Caution

GUID-D6F43A01-4379-4BA1-8019-E75693455CED-low.gif This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.