SBOSA30C March   2022  – October 2023 INA241A , INA241B

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Device Comparison
  7. 6 Pin Configuration and Functions
  8. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Amplifier Input Common-Mode Signal
        1. 8.3.1.1 Enhanced PWM Rejection Operation
        2. 8.3.1.2 Input-Signal Bandwidth
        3. 8.3.1.3 Low Input Bias Current
        4. 8.3.1.4 Low VSENSE Operation
        5. 8.3.1.5 Wide Fixed Gain Output
        6. 8.3.1.6 Wide Supply Range
    4. 8.4 Device Functional Modes
      1. 8.4.1 Adjusting the Output With the Reference Pins
      2. 8.4.2 Reference Pin Connections for Unidirectional Current Measurements
        1. 8.4.2.1 Ground Referenced Output
        2. 8.4.2.2 VS Referenced Output
      3. 8.4.3 Reference Pin Connections for Bidirectional Current Measurements
        1. 8.4.3.1 Output Set to External Reference Voltage
        2. 8.4.3.2 Output Set to Mid-Supply Voltage
        3. 8.4.3.3 Output Set to Mid-External Reference
        4. 8.4.3.4 Output Set Using Resistor Divider
      4. 8.4.4 High Signal Throughput
  10. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 RSENSE and Device Gain Selection
    2. 9.2 Typical Application
      1. 9.2.1 Inline Motor Current-Sense Application
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curve
    3. 9.3 Power Supply Recommendations
      1. 9.3.1 Power Supply Decoupling
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Examples
  11. 10Device and Documentation Support
    1. 10.1 Receiving Notification of Documentation Updates
    2. 10.2 Support Resources
    3. 10.3 Trademarks
    4. 10.4 Electrostatic Discharge Caution
    5. 10.5 Glossary
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.4 Thermal Information

THERMAL METRIC(1) INA241x UNIT
DDF (SOT23) DGK (VSSOP) D (SOIC) DGS (VSSOP)(2)
8 PINS 8 PINS 8 PINS 10 PINS
RθJA Junction-to-ambient thermal resistance 129.7 167.2 122.9 TBD °C/W
RθJC(top) Junction-to-case (top) thermal resistance 58 58.9 54.7
TBD

 °C/W
RθJB Junction-to-board thermal resistance 52.6 88.9 68.8
TBD

 °C/W
ΨJT Junction-to-top characterization parameter 2.3 8.1 12.2
TBD

 °C/W
ΨJB Junction-to-board characterization parameter 52.3 87.4 67.5
TBD

 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.
(2) This package is preview only.