SBOS950A July   2019  – January 2021 INA253-Q1

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Integrated Shunt Resistor
      2. 7.3.2 Short-Circuit Duration
      3. 7.3.3 Temperature Stability
      4. 7.3.4 Enhanced PWM Rejection Operation
      5. 7.3.5 Input Signal Bandwidth
    4. 7.4 Device Functional Modes
      1. 7.4.1 Adjusting the Output Midpoint With the Reference Pins
      2. 7.4.2 Reference Pin Connections for Unidirectional Current Measurements
      3. 7.4.3 Ground Referenced Output
      4. 7.4.4 Reference Pin Connections for Bidirectional Current Measurements
        1. 7.4.4.1 Output Set to External Reference Voltage
      5. 7.4.5 Output Set to Mid-Supply Voltage
      6. 7.4.6 Output Set to Mid-External Reference
      7. 7.4.7 Output Set Using Resistor Divide
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Input Filtering
    2. 8.2 Typical Applications
      1. 8.2.1 High-Side, High-Drive, Solenoid Current-Sense Application
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curve
      2. 8.2.2 Speaker Enhancements and Diagnostics Using Current Sense Amplifier
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
        3. 8.2.2.3 Application Curve
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
    2. 11.2 Related Documentation
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Support Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

THERMAL METRIC(1)INA253-Q1UNIT
PW (TSSOP)
20 PINS
RθJAJunction-to-ambient thermal resistance110.6°C/W
RθJC(top)Junction-to-case (top) thermal resistance54.1°C/W
RθJBJunction-to-board thermal resistance87.5°C/W
ψJTJunction-to-top characterization parameter114.1°C/W
ψJBJunction-to-board characterization parameter87.5°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.