SLOS954A July   2018  – December 2018 INA253

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Typical Application
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Integrated Shunt Resistor
      2. 8.3.2 Short-Circuit Duration
      3. 8.3.3 Temperature Stability
      4. 8.3.4 Enhanced PWM Rejection Operation
      5. 8.3.5 Input Signal Bandwidth
    4. 8.4 Device Functional Modes
      1. 8.4.1 Adjusting the Output Midpoint With the Reference Pins
      2. 8.4.2 Reference Pin Connections for Unidirectional Current Measurements
      3. 8.4.3 Ground Referenced Output
      4. 8.4.4 Reference Pin Connections for Bidirectional Current Measurements
        1. 8.4.4.1 Output Set to External Reference Voltage
      5. 8.4.5 Output Set to Mid-Supply Voltage
      6. 8.4.6 Output Set to Mid-External Reference
      7. 8.4.7 Output Set Using Resistor Divide
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Input Filtering
    2. 9.2 Typical Applications
      1. 9.2.1 High-Side, High-Drive, Solenoid Current-Sense Application
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curve
      2. 9.2.2 Speaker Enhancements and Diagnostics Using Current Sense Amplifier
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
        3. 9.2.2.3 Application Curve
      3. 9.2.3 Current Sensing for Remote I/Os in PLC
        1. 9.2.3.1 Design Requirements
        2. 9.2.3.2 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Development Support
    2. 12.2 Related Documentation
    3. 12.3 Receiving Notification of Documentation Updates
    4. 12.4 Community Resources
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.4 Thermal Information

THERMAL METRIC(1) INA253 UNIT
PW (TSSOP)
20 PINS
RθJA Junction-to-ambient thermal resistance 110.6 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 54.1 °C/W
RθJB Junction-to-board thermal resistance 87.5 °C/W
ψJT Junction-to-top characterization parameter 114.1 °C/W
ψJB Junction-to-board characterization parameter 87.5 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.