SBOS764B December   2015  – December 2021 INA300-Q1

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Selecting a Current-Sensing Resistor
        1. 7.3.1.1 Selecting a Current-Sensing Resistor: Example
      2. 7.3.2 Setting The Current-Limit Threshold
        1. 7.3.2.1 Resistor-Controlled Current Limit
        2. 7.3.2.2 Voltage Source-Controlled Current Limit
      3. 7.3.3 Delay Setting
      4. 7.3.4 Alert Timing Response
      5. 7.3.5 Selectable Hysteresis
      6. 7.3.6 Alert Output
      7. 7.3.7 Noise Adjustment Factor (NAF)
    4. 7.4 Device Functional Modes
      1. 7.4.1 Alert Mode
        1. 7.4.1.1 Transparent Output Mode
        2. 7.4.1.2 Latch Output Mode
      2. 7.4.2 Disable Mode
      3. 7.4.3 Input Filtering
      4. 7.4.4 Using the INA300-Q1 INA300-Q1 With Common-Mode Transients Above 36 V
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Unidirectional Operation
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curve
      2. 8.2.2 Bidirectional Operation
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
        3. 8.2.2.3 Application Curve
      3. 8.2.3 Window Comparator
        1. 8.2.3.1 Design Requirements
        2. 8.2.3.2 Detailed Design Procedure
        3. 8.2.3.3 Application Curve
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

THERMAL METRIC(1)INA300-Q1UNIT
DGS (VSSOP)
10 PINS
RθJAJunction-to-ambient thermal resistance169.4°C/W
RθJC(top)Junction-to-case (top) thermal resistance59.1°C/W
RθJBJunction-to-board thermal resistance89.6°C/W
ψJTJunction-to-top characterization parameter8.5°C/W
ψJBJunction-to-board characterization parameter88.3°C/W
RθJC(bot)Junction-to-case (bottom) thermal resistanceN/A°C/W
(1) For more information about traditional and new thermal metrics, see Semiconductor and IC Package Thermal Metrics.