SBOS775C September   2016  – March 2019 INA302 , INA303

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Typical Application
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Bidirectional Current Sensing
      2. 7.3.2 Out-of-Range Detection
      3. 7.3.3 Alert Outputs
        1. 7.3.3.1 Setting Alert Thresholds
          1. 7.3.3.1.1 Resistor-Controlled Current Limit
            1. 7.3.3.1.1.1 Resistor-Controlled Current Limit: Example
          2. 7.3.3.1.2 Voltage-Source-Controlled Current Limit
        2. 7.3.3.2 Hysteresis
    4. 7.4 Device Functional Modes
      1. 7.4.1 Alert Operating Modes
        1. 7.4.1.1 Transparent Output Mode
        2. 7.4.1.2 Latch Output Mode
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Selecting a Current-Sensing Resistor (RSENSE)
        1. 8.1.1.1 Selecting a Current-Sensing Resistor: Example
      2. 8.1.2 Input Filtering
      3. 8.1.3 Using the INA30x With Common-Mode Transients Greater Than 36 V
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Related Links
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Community Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

10.1 Layout Guidelines

  • Apply connections to the current-sense resistor, RSENSE, on the inside of the resistor pads to avoid additional voltage losses incurred by the high current traces to the resistor. Route the traces from the current-sense resistor symmetrically and side-by-side back to the input of the INA to minimize common-mode errors and noise pickup.
  • Place the power-supply bypass capacitor as closely as possible to the supply and ground pins. The recommended value of this bypass capacitor is 0.1 µF. Additional decoupling capacitance can be added to compensate for noisy or high-impedance power supplies.
  • Make the connection of RLIMIT to the ground pin as direct as possible to limit additional capacitance on this node. Routing this connection must be limited to the same plane if possible to avoid vias to internal planes. If the routing can not be made on the same plane and must pass through vias, make sure that a path is routed from RLIMIT back to the ground pin, and that RLIMIT is not simply connected directly to a ground plane.
  • Routing to the delay capacitor must be short and direct. Keep the routing trace from the DELAY pin to the delay capacitor away from the ALERT2 trace (or any other noisy signals) to minimize any coupling effects. If no delay capacitor is used do not have any connection to the DELAY pin. Long trace lengths on the DELAY pin can cause noise to couple to the device, resulting in false trips.
  • Pull up the open-drain output pins to the supply voltage rail; a 10-kΩ pullup resistor is recommended.