SBOS775C September   2016  – March 2019 INA302 , INA303

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Typical Application
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Bidirectional Current Sensing
      2. 7.3.2 Out-of-Range Detection
      3. 7.3.3 Alert Outputs
        1. 7.3.3.1 Setting Alert Thresholds
          1. 7.3.3.1.1 Resistor-Controlled Current Limit
            1. 7.3.3.1.1.1 Resistor-Controlled Current Limit: Example
          2. 7.3.3.1.2 Voltage-Source-Controlled Current Limit
        2. 7.3.3.2 Hysteresis
    4. 7.4 Device Functional Modes
      1. 7.4.1 Alert Operating Modes
        1. 7.4.1.1 Transparent Output Mode
        2. 7.4.1.2 Latch Output Mode
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Selecting a Current-Sensing Resistor (RSENSE)
        1. 8.1.1.1 Selecting a Current-Sensing Resistor: Example
      2. 8.1.2 Input Filtering
      3. 8.1.3 Using the INA30x With Common-Mode Transients Greater Than 36 V
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Related Links
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Community Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

THERMAL METRIC(1) INA30x UNIT
PW (TSSOP)
14 PINS
RθJA Junction-to-ambient thermal resistance 110.2 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 35.1 °C/W
RθJB Junction-to-board thermal resistance 53.2 °C/W
ψJT Junction-to-top characterization parameter 2.3 °C/W
ψJB Junction-to-board characterization parameter 52.4 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.