SBOSAD3 may   2023 INA310A-Q1 , INA310B-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Amplifier Input Common-Mode Signal
      2. 7.3.2  Input-Signal Bandwidth
      3. 7.3.3  Low Input Bias Current
      4. 7.3.4  Low VSENSE Operation
      5. 7.3.5  Wide Fixed Gain Output
      6. 7.3.6  Wide Supply Range
      7. 7.3.7  Integrated Comparator
      8. 7.3.8  RESET Function
      9. 7.3.9  Short Propagation Delay
      10. 7.3.10 Comparator Input Bias Current
    4. 7.4 Device Functional Modes
      1. 7.4.1 Basic Connections
        1. 7.4.1.1 Overcurrent Threshold Connection
      2. 7.4.2 High-Side Switch Overcurrent Shutdown
      3. 7.4.3 Bidirectional Overcurrent Comparator
  9. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 RSENSE and Device Gain Selection
    2. 8.2 Typical Application
      1. 8.2.1 Current Sensing in a Solenoid Application
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Overload Recovery With Negative VSENSE
        4. 8.2.1.4 Application Curve
      2. 8.2.2 Low-Side Switch Overcurrent Shutdown
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
        3. 8.2.2.3 Application Curve
    3. 8.3 Power Supply Recommendations
      1. 8.3.1 Power Supply Decoupling
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9.4 Electrostatic Discharge Caution

GUID-D6F43A01-4379-4BA1-8019-E75693455CED-low.gif This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.