SBOSAD3 may   2023 INA310A-Q1 , INA310B-Q1

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Revision History
  6. Pin Configuration and Functions
  7. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  8. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Amplifier Input Common-Mode Signal
      2. 7.3.2  Input-Signal Bandwidth
      3. 7.3.3  Low Input Bias Current
      4. 7.3.4  Low VSENSE Operation
      5. 7.3.5  Wide Fixed Gain Output
      6. 7.3.6  Wide Supply Range
      7. 7.3.7  Integrated Comparator
      8. 7.3.8  RESET Function
      9. 7.3.9  Short Propagation Delay
      10. 7.3.10 Comparator Input Bias Current
    4. 7.4 Device Functional Modes
      1. 7.4.1 Basic Connections
        1. 7.4.1.1 Overcurrent Threshold Connection
      2. 7.4.2 High-Side Switch Overcurrent Shutdown
      3. 7.4.3 Bidirectional Overcurrent Comparator
  9. Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 RSENSE and Device Gain Selection
    2. 8.2 Typical Application
      1. 8.2.1 Current Sensing in a Solenoid Application
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Overload Recovery With Negative VSENSE
        4. 8.2.1.4 Application Curve
      2. 8.2.2 Low-Side Switch Overcurrent Shutdown
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
        3. 8.2.2.3 Application Curve
    3. 8.3 Power Supply Recommendations
      1. 8.3.1 Power Supply Decoupling
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Layout Guidelines

Attention to good layout practices is always recommended.

  • Connect the input pins to the sensing resistor using a Kelvin or 4-wire connection. This connection technique makes sure that only the current-sensing resistor impedance is detected between the input pins. Poor routing of the current-sensing resistor commonly results in additional resistance present between the input pins. Given the very low ohmic value of the current resistor, any additional high-current carrying impedance can cause significant measurement errors.
  • Place the power-supply bypass capacitor as close to the device power-supply and ground pins as possible. The recommended value of this bypass capacitor is 0.1 µF. Additional decoupling capacitance can be added to compensate for noisy or high-impedance power supplies.