SBOSAD3 may   2023 INA310A-Q1 , INA310B-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Amplifier Input Common-Mode Signal
      2. 7.3.2  Input-Signal Bandwidth
      3. 7.3.3  Low Input Bias Current
      4. 7.3.4  Low VSENSE Operation
      5. 7.3.5  Wide Fixed Gain Output
      6. 7.3.6  Wide Supply Range
      7. 7.3.7  Integrated Comparator
      8. 7.3.8  RESET Function
      9. 7.3.9  Short Propagation Delay
      10. 7.3.10 Comparator Input Bias Current
    4. 7.4 Device Functional Modes
      1. 7.4.1 Basic Connections
        1. 7.4.1.1 Overcurrent Threshold Connection
      2. 7.4.2 High-Side Switch Overcurrent Shutdown
      3. 7.4.3 Bidirectional Overcurrent Comparator
  9. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 RSENSE and Device Gain Selection
    2. 8.2 Typical Application
      1. 8.2.1 Current Sensing in a Solenoid Application
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Overload Recovery With Negative VSENSE
        4. 8.2.1.4 Application Curve
      2. 8.2.2 Low-Side Switch Overcurrent Shutdown
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
        3. 8.2.2.3 Application Curve
    3. 8.3 Power Supply Recommendations
      1. 8.3.1 Power Supply Decoupling
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

THERMAL METRIC(1) INA310x-Q1 UNIT
DGK (VSSOP)
8 PINS
RθJA Junction-to-ambient thermal resistance 172.2 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 63.5 °C/W
RθJB Junction-to-board thermal resistance 93.8 °C/W
ΨJT Junction-to-top characterization parameter 9.8 °C/W
ΨJB Junction-to-board characterization parameter 92.2 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.