SBOSA86 March   2023 INA310A , INA310B

PRODUCTION DATA  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Amplifier Input Common-Mode Signal
      2. 7.3.2  Input-Signal Bandwidth
      3. 7.3.3  Low Input Bias Current
      4. 7.3.4  Low VSENSE Operation
      5. 7.3.5  Wide Fixed Gain Output
      6. 7.3.6  Wide Supply Range
      7. 7.3.7  Integrated Comparator
      8. 7.3.8  RESET Function
      9. 7.3.9  Short Propagation Delay
      10. 7.3.10 Comparator Input Bias Current
    4. 7.4 Device Functional Modes
      1. 7.4.1 Basic Connections
        1. 7.4.1.1 Overcurrent Threshold Connection
      2. 7.4.2 High-Side Switch Overcurrent Shutdown
      3. 7.4.3 Bidirectional Overcurrent Comparator
  8. Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 RSENSE and Device Gain Selection
    2. 8.2 Typical Application
      1. 8.2.1 Current Sensing in a Solenoid Application
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Overload Recovery With Negative VSENSE
        3. 8.2.1.3 Application Curve
      2. 8.2.2 Low-Side Switch Overcurrent Shutdown
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
        3. 8.2.2.3 Application Curve
    3. 8.3 Power Supply Recommendations
      1. 8.3.1 Power Supply Decoupling
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  9. Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  10. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Application and Implementation

Note:

Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes, as well as validating and testing their design implementation to confirm system functionality.