SBOS576B May   2012  – March 2016 INA3221

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Basic ADC Functions
      2. 8.3.2 Alert Monitoring
        1. 8.3.2.1 Critical Alert
          1. 8.3.2.1.1 Summation Control Function
        2. 8.3.2.2 Warning Alert
        3. 8.3.2.3 Power-Valid Alert
        4. 8.3.2.4 Timing-Control Alert
        5. 8.3.2.5 Default Settings
      3. 8.3.3 Software Reset
    4. 8.4 Device Functional Modes
      1. 8.4.1 Averaging Function
      2. 8.4.2 Multiple Channel Monitoring
        1. 8.4.2.1 Channel Configuration
        2. 8.4.2.2 Averaging and Conversion-Time Considerations
      3. 8.4.3 Filtering and Input Considerations
    5. 8.5 Programming
      1. 8.5.1 Bus Overview
        1. 8.5.1.1 Serial Bus Address
        2. 8.5.1.2 Serial Interface
      2. 8.5.2 Writing To and Reading From the INA3221
        1. 8.5.2.1 High-Speed I2C Mode
      3. 8.5.3 SMBus Alert Response
    6. 8.6 Register Maps
      1. 8.6.1 Summary of Register Set
      2. 8.6.2 Register Descriptions
        1. 8.6.2.1  Configuration Register (address = 00h) [reset = 7127h]
        2. 8.6.2.2  Channel-1 Shunt-Voltage Register (address = 01h), [reset = 00h]
        3. 8.6.2.3  Channel-1 Bus-Voltage Register (address = 02h) [reset = 00h]
        4. 8.6.2.4  Channel-2 Shunt-Voltage Register (address = 03h) [reset = 00h]
        5. 8.6.2.5  Channel-2 Bus-Voltage Register (address = 04h) [reset = 00h]
        6. 8.6.2.6  Channel-3 Shunt-Voltage Register (address = 05h) [reset = 00h]
        7. 8.6.2.7  Channel-3 Bus-Voltage Register (address = 06h) [reset = 00h]
        8. 8.6.2.8  Channel-1 Critical-Alert Limit Register (address = 07h) [reset = 7FF8h]
        9. 8.6.2.9  Warning-Alert Channel-1 Limit Register (address = 08h) [reset = 7FF8h]
        10. 8.6.2.10 Channel-2 Critical-Alert Limit Register (address = 09h) [reset = 7FF8h]
        11. 8.6.2.11 Channel-2 Warning-Alert Limit Register (address = 0Ah) [reset = 7FF8h]
        12. 8.6.2.12 Channel-3 Critical-Alert Limit Register (address = 0Bh) [reset = 7FF8h]
        13. 8.6.2.13 Channel-3 Warning-Alert Limit Register (address = 0Ch) [reset = 7FF8h]
        14. 8.6.2.14 Shunt-Voltage Sum Register (address = 0Dh) [reset = 00h]
        15. 8.6.2.15 Shunt-Voltage Sum-Limit Register (address = 0Eh) [reset = 7FFEh]
        16. 8.6.2.16 Mask/Enable Register (address = 0Fh) [reset = 0002h]
        17. 8.6.2.17 Power-Valid Upper-Limit Register (address = 10h) [reset = 2710h]
        18. 8.6.2.18 Power-Valid Lower-Limit Register (address = 11h) [reset = 2328h]
        19. 8.6.2.19 Manufacturer ID Register (address = FEh) [reset = 5449h]
        20. 8.6.2.20 Die ID Register (address = FFh) [reset = 3220]
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Development Support
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Community Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • RGV|16
Thermal pad, mechanical data (Package|Pins)

12 Device and Documentation Support

12.1 Device Support

12.1.1 Development Support

12.2 Documentation Support

12.2.1 Related Documentation

12.3 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

12.4 Trademarks

E2E is a trademark of Texas Instruments.

All other trademarks are the property of their respective owners.

12.5 Electrostatic Discharge Caution

esds-image

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

12.6 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.