SBOSAA0C november   2021  – may 2023 INA350

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Device Comparison Table
  7. 6 Pin Configuration and Functions
  8. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Gain-Setting
        1. 8.3.1.1 Gain Error and Drift
      2. 8.3.2 Input Common-Mode Voltage Range
      3. 8.3.3 EMI Rejection
      4. 8.3.4 Typical Specifications and Distributions
      5. 8.3.5 Electrical Overstress
    4. 8.4 Device Functional Modes
  10. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Reference Pin
      2. 9.1.2 Input Bias Current Return Path
    2. 9.2 Typical Applications
      1. 9.2.1 Resistive-Bridge Pressure Sensor
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Device Support
      1. 10.1.1 Development Support
        1. 10.1.1.1 PSpice® for TI
    2. 10.2 Documentation Support
      1. 10.2.1 Related Documentation
    3. 10.3 Receiving Notification of Documentation Updates
    4. 10.4 Support Resources
    5. 10.5 Trademarks
    6. 10.6 Electrostatic Discharge Caution
    7. 10.7 Glossary
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

1 Features

  • Ideal for size, cost, and power conscious designs
  • Selectable gain options
    • G = 10 or G = 20 (INA350ABS)
    • G = 30 or G = 50 (INA350CDS)
  • Space saving ultra-small package options
    • 10-pin X2QFN (RUG) – 3 mm2
    • 8-pin WSON (DSG) – 4 mm2
    • 8-pin SOT23-THN (DDF) – 4.64 mm2
  • Optimized performance for 10-bit to 14-bit systems
    • CMRR: 95 dB (typical) across all gains
    • Offset voltage: 0.2 mV (typical) across all gains
    • Gain error (typical):
      • 0.05% for G = 10; 0.06% for G = 20
      • 0.075% for G = 30; 0.082% for G = 50
  • Bandwidth: 100 kHz for G = 10 (typical)
  • Drives 500 pF with less than 20% overshoot (typical)
  • Optimized quiescent current: 100 µA (typical)
  • Shutdown option for power conscious applications
  • Supply range: 1.8 V (±0.9 V) to 5.5 V (±2.75 V)
  • Specified temperature range: –40°C to 125°C