SBOSAB5 May   2024 INA4235

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Requirements (I2C)
    7. 5.7 Timing Diagram
    8. 5.8 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Integrated Analog-to-Digital Converter (ADC)
      2. 6.3.2 Internal Measurement and Calculation Engine
      3. 6.3.3 Low Bias Current
      4. 6.3.4 Low Voltage Supply and Wide Common-Mode Voltage Range
      5. 6.3.5 ALERT Pin
    4. 6.4 Device Functional Modes
      1. 6.4.1 Continuous Versus Triggered Operation
      2. 6.4.2 Device Low Power Modes
      3. 6.4.3 Power-On Reset
      4. 6.4.4 Averaging and Conversion Time Considerations
    5. 6.5 Programming
      1. 6.5.1 I2C Serial Interface
      2. 6.5.2 Writing to and Reading Through the I2C Serial Interface
      3. 6.5.3 High-Speed I2C Mode
      4. 6.5.4 General Call Reset
      5. 6.5.5 SMBus Alert Response
  8. 7 Register Maps
    1. 7.1 Device Registers
  9. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Device Measurement Range and Resolution
      2. 8.1.2 Current and Power Calculations
      3. 8.1.3 ADC Output Data Rate and Noise Performance
      4. 8.1.4 Filtering and Input Considerations
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Select the Shunt Resistor
        2. 8.2.2.2 Configure the Device
        3. 8.2.2.3 Program the Shunt Calibration Registers
        4. 8.2.2.4 Set Desired Fault Thresholds
        5. 8.2.2.5 Calculate Returned Values
      3. 8.2.3 Application Curves
  10. 9 Power Supply Recommendations
  11. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  12. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Support Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  13. 12Revision History
  14. 13Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • YBJ|16
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.8 Typical Characteristics

at TA = 25°C, VVS = 3.3V, VCM = 12V, and VSENSE = (VIN+ – VIN–) = 0mV (unless otherwise noted)

INA4235 Frequency Response
Figure 5-2 Frequency Response
INA4235 Shunt Input Offset Voltage vs. Temperature
Figure 5-4 Shunt Input Offset Voltage vs. Temperature
INA4235 Shunt Input CMRR vs. Temperature
Figure 5-6 Shunt Input CMRR vs. Temperature
INA4235 Shunt Gain Error vs. Temperature
Figure 5-8 Shunt Gain Error vs. Temperature
INA4235
Figure 5-10 Bus Offset Voltage (VIN-) Production Distribution
INA4235 Bus Voltage (VIN-) Gain Error Production Distribution
Figure 5-12 Bus Voltage (VIN-) Gain Error Production Distribution
INA4235 Input Bias Current vs. Differential Voltage
Figure 5-14 Input Bias Current vs. Differential Voltage
INA4235 Input Bias Current vs. Temperature
Figure 5-16 Input Bias Current vs. Temperature
INA4235 Quiescent Current vs. Supply Voltage
Figure 5-18 Quiescent Current vs. Supply Voltage
INA4235 Quiescent Current - Shutdown vs. Temperature
Figure 5-20 Quiescent Current - Shutdown vs. Temperature
INA4235 Quiescent Current vs. Clock(SCL) Frequency
Figure 5-22 Quiescent Current vs. Clock(SCL) Frequency
INA4235 Shunt Input Offset Voltage Production Distribution
Figure 5-3 Shunt Input Offset Voltage Production Distribution
INA4235 CMRR Production Distribution
Figure 5-5 CMRR Production Distribution
INA4235 Shunt Voltage Gain Error Production Distribution
Figure 5-7 Shunt Voltage Gain Error Production Distribution
INA4235 Shunt Gain Error vs. Common-Mode Voltage
Figure 5-9 Shunt Gain Error vs. Common-Mode Voltage
INA4235 Bus Offset Voltage (VIN-) vs. Temperature
Figure 5-11 Bus Offset Voltage (VIN-) vs. Temperature
INA4235 Bus Voltage (VIN-) Gain Error vs. Temperature
Figure 5-13 Bus Voltage (VIN-) Gain Error vs. Temperature
INA4235 Input Bias Current vs. Common-Mode Voltage (IB+, IB-)
Figure 5-15 Input Bias Current vs. Common-Mode Voltage (IB+, IB-)
INA4235 Quiescent Current vs. Temperature
Figure 5-17 Quiescent Current vs. Temperature
INA4235 Quiescent Current - Shutdown vs. Supply Voltage
Figure 5-19 Quiescent Current - Shutdown vs. Supply Voltage
INA4235 Quiescent Current - Disabled vs. Temperature
Figure 5-21 Quiescent Current - Disabled vs. Temperature
INA4235 Quiescent Current - Shutdown vs. SCL Frequency
Figure 5-23 Quiescent Current - Shutdown vs. SCL Frequency