SBOSAB5 May   2024 INA4235

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Requirements (I2C)
    7. 5.7 Timing Diagram
    8. 5.8 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Integrated Analog-to-Digital Converter (ADC)
      2. 6.3.2 Internal Measurement and Calculation Engine
      3. 6.3.3 Low Bias Current
      4. 6.3.4 Low Voltage Supply and Wide Common-Mode Voltage Range
      5. 6.3.5 ALERT Pin
    4. 6.4 Device Functional Modes
      1. 6.4.1 Continuous Versus Triggered Operation
      2. 6.4.2 Device Low Power Modes
      3. 6.4.3 Power-On Reset
      4. 6.4.4 Averaging and Conversion Time Considerations
    5. 6.5 Programming
      1. 6.5.1 I2C Serial Interface
      2. 6.5.2 Writing to and Reading Through the I2C Serial Interface
      3. 6.5.3 High-Speed I2C Mode
      4. 6.5.4 General Call Reset
      5. 6.5.5 SMBus Alert Response
  8. 7 Register Maps
    1. 7.1 Device Registers
  9. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Device Measurement Range and Resolution
      2. 8.1.2 Current and Power Calculations
      3. 8.1.3 ADC Output Data Rate and Noise Performance
      4. 8.1.4 Filtering and Input Considerations
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Select the Shunt Resistor
        2. 8.2.2.2 Configure the Device
        3. 8.2.2.3 Program the Shunt Calibration Registers
        4. 8.2.2.4 Set Desired Fault Thresholds
        5. 8.2.2.5 Calculate Returned Values
      3. 8.2.3 Application Curves
  10. 9 Power Supply Recommendations
  11. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  12. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Support Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  13. 12Revision History
  14. 13Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • YBJ|16
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.2.2.5 Calculate Returned Values

Parametric values are calculated by multiplying the returned value by the LSB value. Table 8-4 shows the returned values for this application example, assuming the design requirements shown in Table 8-3.

Table 8-4 Register Values
RegisterContentsLSB ValueCalculated Value
Shunt_Voltage_CH1 (00h) 19200d (4B00h)2.5µV19200 × 2.5μV = 0.048V
Bus_Voltage_CH1 (01h)7500d (1D4Ch)1.6mV7500 × 1.6mV = 12V
Current_CH1 (02h)12000d (2EE0h)Current LSB = 500µA12000 × 500µA = 6A
Power_CH1 (03h)4500d (1194h)Current LSB x 32 = 16mW4500 × 16mW = 72W
Energy_CH1 (04h)16200000d (00F7 3140h)Current LSB x 32 = 16mJ16200000 × 16mJ = 259.2kJ

Shunt Voltage and Current return values in two's complement format. In two's complement format a negative value in binary is represented by having a 1 in the most significant bit of the returned value. These values can be converted to decimal by first inverting all the bits and adding 1 to obtain the unsigned binary value. This value must then be converted to decimal with the negative sign applied.