SBOSAB5 May   2024 INA4235

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Requirements (I2C)
    7. 5.7 Timing Diagram
    8. 5.8 Typical Characteristics
  7. Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Integrated Analog-to-Digital Converter (ADC)
      2. 6.3.2 Internal Measurement and Calculation Engine
      3. 6.3.3 Low Bias Current
      4. 6.3.4 Low Voltage Supply and Wide Common-Mode Voltage Range
      5. 6.3.5 ALERT Pin
    4. 6.4 Device Functional Modes
      1. 6.4.1 Continuous Versus Triggered Operation
      2. 6.4.2 Device Low Power Modes
      3. 6.4.3 Power-On Reset
      4. 6.4.4 Averaging and Conversion Time Considerations
    5. 6.5 Programming
      1. 6.5.1 I2C Serial Interface
      2. 6.5.2 Writing to and Reading Through the I2C Serial Interface
      3. 6.5.3 High-Speed I2C Mode
      4. 6.5.4 General Call Reset
      5. 6.5.5 SMBus Alert Response
  8. Register Maps
    1. 7.1 Device Registers
  9. Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Device Measurement Range and Resolution
      2. 8.1.2 Current and Power Calculations
      3. 8.1.3 ADC Output Data Rate and Noise Performance
      4. 8.1.4 Filtering and Input Considerations
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Select the Shunt Resistor
        2. 8.2.2.2 Configure the Device
        3. 8.2.2.3 Program the Shunt Calibration Registers
        4. 8.2.2.4 Set Desired Fault Thresholds
        5. 8.2.2.5 Calculate Returned Values
      3. 8.2.3 Application Curves
  10. Power Supply Recommendations
  11. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  12. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Support Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  13. 12Revision History
  14. 13Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • YBJ|16
Thermal pad, mechanical data (Package|Pins)
Orderable Information

I2C Serial Interface

The INA4235 operates only as a target on both the SMBus and I2C interfaces. Connections to the bus are made through the open-drain SDA and SCL lines. The SDA and SCL pins feature integrated spike suppression filters and Schmitt triggers to minimize the effects of input spikes and bus noise. Although the device integrates spike suppression into the digital I/O lines, proper layout techniques help minimize the amount of coupling into the communication lines. This noise introduction can occur from capacitive coupling signal edges between the two communication lines themselves or from other switching noise sources present in the system. Routing traces in parallel with ground in between layers on a printed circuit board (PCB) typically reduces the effects of coupling between the communication lines. Shielded communication lines reduce the possibility of unintended noise coupling into the digital I/O lines that can be incorrectly interpreted as start or stop commands.

The INA4235 supports the transmission protocol for fast mode (1kHz to 400kHz) and high-speed mode (1kHz to 2.94MHz). All data bytes are transmitted most significant byte first and follow the SMBus 3.0 transfer protocol.

To communicate with the INA4235, the controller must first address targets through a target address byte. The target address byte consists of seven address bits and a direction bit that indicates whether the action is to be a read or write operation.

The device has two address pins, A0 and A1. Table 6-1 lists the pin connections required for each of the 16 possible addresses. The device samples the state of pins A0 and A1 on every bus communication. Establish the pin state before any activity on the interface occurs.

Table 6-1 Address Pins and Target Addresses
A1A0TARGET DEVICE ADDRESS
GNDGND1000000
GNDVS1000001
GNDSDA1000010
GNDSCL1000011
VSGND1000100
VSVS1000101
VSSDA1000110
VSSCL1000111
SDAGND1001000
SDAVS1001001
SDASDA1001010
SDASCL1001011
SCLGND1001100
SCLVS1001101
SCLSDA1001110
SCLSCL1001111