SBOSAB5 May   2024 INA4235

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Requirements (I2C)
    7. 5.7 Timing Diagram
    8. 5.8 Typical Characteristics
  7. Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Integrated Analog-to-Digital Converter (ADC)
      2. 6.3.2 Internal Measurement and Calculation Engine
      3. 6.3.3 Low Bias Current
      4. 6.3.4 Low Voltage Supply and Wide Common-Mode Voltage Range
      5. 6.3.5 ALERT Pin
    4. 6.4 Device Functional Modes
      1. 6.4.1 Continuous Versus Triggered Operation
      2. 6.4.2 Device Low Power Modes
      3. 6.4.3 Power-On Reset
      4. 6.4.4 Averaging and Conversion Time Considerations
    5. 6.5 Programming
      1. 6.5.1 I2C Serial Interface
      2. 6.5.2 Writing to and Reading Through the I2C Serial Interface
      3. 6.5.3 High-Speed I2C Mode
      4. 6.5.4 General Call Reset
      5. 6.5.5 SMBus Alert Response
  8. Register Maps
    1. 7.1 Device Registers
  9. Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Device Measurement Range and Resolution
      2. 8.1.2 Current and Power Calculations
      3. 8.1.3 ADC Output Data Rate and Noise Performance
      4. 8.1.4 Filtering and Input Considerations
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Select the Shunt Resistor
        2. 8.2.2.2 Configure the Device
        3. 8.2.2.3 Program the Shunt Calibration Registers
        4. 8.2.2.4 Set Desired Fault Thresholds
        5. 8.2.2.5 Calculate Returned Values
      3. 8.2.3 Application Curves
  10. Power Supply Recommendations
  11. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  12. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Support Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  13. 12Revision History
  14. 13Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • YBJ|16
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Low Bias Current

When performing a current measurement, the INA4235 features very low input bias current which provides several benefits. The low input bias current of the INA4235 reduces the current consumed by the device in both active and shutdown state. Another benefit of low bias current is that low bias current allows the use of input filters to reject high-frequency noise before the signal is converted to digital data. In traditional digital current-sense monitors, the addition of input filters comes at the cost of reduced accuracy. However, as a result of the low bias current, the reduction in accuracy due to input filters is minimized. An additional benefit of low bias current is the ability to use a larger shunt resistor to accurately sense smaller currents. Use of a larger value for the shunt resistor allows the device to accurately monitor currents in the sub-mA range.

The bias current in the INA4235 is the smallest when the sensed current is zero. As the current starts to increase, the differential voltage drop across the shunt resistor increases which results in an increase in the bias current (see Figure 5-14).

The INA4235 has low bias current only when making a current measurement. When bus voltage measurements are made, the impedance of the IN- pins decrease. During bus voltage measurements the IN- pins are connected to an internal resistor divider with an impedance of approximately 1MΩ. Configuring the internal multiplexer to perform only current measurements allows the device to always have low bias current.