SBOSAI9B December   2023  – March 2024 INA500

PRODMIX  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics - INA500A
    6. 6.6 Electrical Characteristics - INA500B
    7. 6.7 Electrical Characteristics - INA500C
    8. 6.8 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Gain Options and Resistors
        1. 7.3.1.1 Gain Error and Drift
      2. 7.3.2 Input Common-Mode Voltage Range
      3. 7.3.3 EMI Rejection
      4. 7.3.4 Typical Specifications and Distributions
      5. 7.3.5 Electrical Overstress
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Reference Pin
    2. 8.2 Typical Applications
      1. 8.2.1 Battery Monitoring using Difference Amplifier
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Development Support
        1. 9.1.1.1 PSpice® for TI
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation
    3. 9.3 Receiving Notification of Documentation Updates
    4. 9.4 Support Resources
    5. 9.5 Trademarks
    6. 9.6 Electrostatic Discharge Caution
    7. 9.7 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DBV|6
  • DCK|6
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

THERMAL METRIC(1) INA500 UNIT
DCK (SC70) DBV (SOT-23) DTQ (X2SON)
6 PINS 6 PINS 6 PINS
RθJA Junction-to-ambient thermal resistance 200.2 195.9 TBD °C/W
RθJC(top) Junction-to-case (top) thermal resistance 127.6 115.5 TBD °C/W
RθJB Junction-to-board thermal resistance 59.6 77.1 TBD °C/W
ψJT Junction-to-top characterization parameter 42.6 52.2 TBD °C/W
ψJB Junction-to-board characterization parameter 59.4 76.8 TBD °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance n/a n/a TBD °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application note.