SBOSAB4A May   2023  – September 2023 INA700

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements (I2C)
    7. 6.7 Timing Diagram
    8. 6.8 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Integrated Shunt Resistor
      2. 7.3.2 Safe Operating Area
      3. 7.3.3 Versatile Measurement Capability
      4. 7.3.4 Internal Measurement and Calculation Engine
      5. 7.3.5 High-Precision Delta-Sigma ADC
        1. 7.3.5.1 Low Latency Digital Filter
        2. 7.3.5.2 Flexible Conversion Times and Averaging
      6. 7.3.6 Integrated Precision Oscillator
      7. 7.3.7 Multi-Alert Monitoring and Fault Detection
    4. 7.4 Device Functional Modes
      1. 7.4.1 Shutdown Mode
      2. 7.4.2 Power-On Reset
    5. 7.5 Programming
      1. 7.5.1 I2C Serial Interface
        1. 7.5.1.1 Writing to and Reading Through the I2C Serial Interface
        2. 7.5.1.2 High-Speed I2C Mode
        3. 7.5.1.3 SMBus Alert Response
    6. 7.6 Register Maps
      1. 7.6.1 INA700 Registers
  9. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Device Measurement Range and Resolution
      2. 8.1.2 ADC Output Data Rate and Noise Performance
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Configure the Device
        2. 8.2.2.2 Set Desired Fault Thresholds
        3. 8.2.2.3 Calculate Returned Values
      3. 8.2.3 Application Curves
  10. 9 Power Supply Recommendations
  11. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  12. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.1.1 Device Measurement Range and Resolution

Table 8-4 shows the full scale voltage on shunt, bus, and temperature measurements, along with their associated step size.

Table 8-1 Register Full Scale Values and Resolution
PARAMETERREGISTER ADDRESSSIZEFULL SCALE VALUERESOLUTION
Current7h16 bit, signed±15.728 480 µA/LSB
Bus voltage5h16 bit, signed, always positive0 V to 40 V3.125 mV/LSB
Die Temperature6h12 bit, signed–40°C to +150°C125 m°C/LSB
Power8h24 bit, unsigned1.6106 kW96 µW/LSB
Energy9h40 bit, unsigned1688.85 MJ1.536 mJ/LSB
ChargeAh40 bit, signed

16.493 MC

30 µC/LSB

The internal die temperature sensor range extends from –256°C to +256°C but is limited by the junction temperature range of –40°C to 125°C. Likewise, the bus voltage measurement range extends up to 102.4 V but is limited by silicon to 40 V.

Current, bus voltage, temperature, power, energy, and charge measurements can be read through their corresponding address registers. Values are calculated by multiplying the returned value by the corresponding LSB size.

Signed values are represented in two's compliment format.

Upon overflow, the ENERGY register will roll over and start from zero. This register value can also be reset at any time by setting the RSTACC bit in the CONFIG register.

An overflow event in the CHARGE register is indicated by the CHARGEOF bit. If an overflow condition occurs, the CHARGE register must be manually reset by setting the RSTACC bit in the CONFIG register.

See Detailed Design Procedure for a design example using these equations.