SBOSAB4A May   2023  – September 2023 INA700

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements (I2C)
    7. 6.7 Timing Diagram
    8. 6.8 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Integrated Shunt Resistor
      2. 7.3.2 Safe Operating Area
      3. 7.3.3 Versatile Measurement Capability
      4. 7.3.4 Internal Measurement and Calculation Engine
      5. 7.3.5 High-Precision Delta-Sigma ADC
        1. 7.3.5.1 Low Latency Digital Filter
        2. 7.3.5.2 Flexible Conversion Times and Averaging
      6. 7.3.6 Integrated Precision Oscillator
      7. 7.3.7 Multi-Alert Monitoring and Fault Detection
    4. 7.4 Device Functional Modes
      1. 7.4.1 Shutdown Mode
      2. 7.4.2 Power-On Reset
    5. 7.5 Programming
      1. 7.5.1 I2C Serial Interface
        1. 7.5.1.1 Writing to and Reading Through the I2C Serial Interface
        2. 7.5.1.2 High-Speed I2C Mode
        3. 7.5.1.3 SMBus Alert Response
    6. 7.6 Register Maps
      1. 7.6.1 INA700 Registers
  9. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Device Measurement Range and Resolution
      2. 8.1.2 ADC Output Data Rate and Noise Performance
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Configure the Device
        2. 8.2.2.2 Set Desired Fault Thresholds
        3. 8.2.2.3 Calculate Returned Values
      3. 8.2.3 Application Curves
  10. 9 Power Supply Recommendations
  11. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  12. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5 Pin Configuration and Functions

GUID-20220705-SS0I-SNC6-KLRR-FDW9RVJ5L8RT-low.svg Figure 5-1 YWF Package8-Pin PowerWCSPTop View
Table 5-1 Pin Functions
PINTYPEDESCRIPTION
NO.NAME
A1IN–Analog inputNegative input to the device. For high-side applications, connect to supply side of the load. For low-side applications, connect to ground.
A3IN+Analog inputPositive input to the device. For high-side applications, connect to the bus power supply. For low-side applications, connect to ground side of the load.
B1GNDGroundGround.
B2A0Digital inputI2C address pin. Connect to GND, SCL, SDA, or VS. See Table 7-2 for a list of available device addresses.
B3SDADigital input/outputOpen-drain bidirectional I2C data.
C1VSPower supplyPower supply, 2.7 V to 5.5 V.
C2ALERTDigital outputOpen-drain alert output, default state is active low.
C3SCLDigital inputOpen-drain I2C clock input.