SBOSAC3A July   2023  – December 2023 INA745A , INA745B

PRODMIX  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Requirements (I2C)
    7. 5.7 Timing Diagram
    8. 5.8 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Integrated Shunt Resistor
      2. 6.3.2 Safe Operating Area
      3. 6.3.3 Versatile Measurement Capability
      4. 6.3.4 Internal Measurement and Calculation Engine
      5. 6.3.5 High-Precision Delta-Sigma ADC
        1. 6.3.5.1 Low Latency Digital Filter
        2. 6.3.5.2 Flexible Conversion Times and Averaging
      6. 6.3.6 Integrated Precision Oscillator
      7. 6.3.7 Multi-Alert Monitoring and Fault Detection
    4. 6.4 Device Functional Modes
      1. 6.4.1 Shutdown Mode
      2. 6.4.2 Power-On Reset
    5. 6.5 Programming
      1. 6.5.1 I2C Serial Interface
        1. 6.5.1.1 Writing to and Reading Through the I2C Serial Interface
        2. 6.5.1.2 High-Speed I2C Mode
        3. 6.5.1.3 SMBus Alert Response
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Device Measurement Range and Resolution
      2. 7.1.2 ADC Output Data Rate and Noise Performance
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 Configure the Device
        2. 7.2.2.2 Set Desired Fault Thresholds
        3. 7.2.2.3 Calculate Returned Values
      3. 7.2.3 Application Curves
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
    5. 7.5 Register Maps
      1. 7.5.1 INA745x Registers
  9. 8 Device and Documentation Support
    1. 8.1 Receiving Notification of Documentation Updates
    2. 8.2 Support Resources
    3. 8.3 Trademarks
    4. 8.4 Electrostatic Discharge Caution
    5. 8.5 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.4 Thermal Information

THERMAL METRIC(1)(2) INA745 UNIT
REL (QFN)
14 PINS
RθJA Junction-to-ambient thermal resistance 103.3 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 56.6 °C/W
RθJB Junction-to-board thermal resistance 66.2 °C/W
ΨJT Junction-to-top characterization parameter 6.1 °C/W
YJB Junction-to-board characterization parameter 65.9 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance n/a °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.
(2) Thermal metrics are relative to the internal die and are conservative relative to the heating that would occur from the package leadframe shunt. For more details on heating, see the Safe Operating Area section.