SBOSAC3A July   2023  – December 2023 INA745A , INA745B

PRODMIX  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Requirements (I2C)
    7. 5.7 Timing Diagram
    8. 5.8 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Integrated Shunt Resistor
      2. 6.3.2 Safe Operating Area
      3. 6.3.3 Versatile Measurement Capability
      4. 6.3.4 Internal Measurement and Calculation Engine
      5. 6.3.5 High-Precision Delta-Sigma ADC
        1. 6.3.5.1 Low Latency Digital Filter
        2. 6.3.5.2 Flexible Conversion Times and Averaging
      6. 6.3.6 Integrated Precision Oscillator
      7. 6.3.7 Multi-Alert Monitoring and Fault Detection
    4. 6.4 Device Functional Modes
      1. 6.4.1 Shutdown Mode
      2. 6.4.2 Power-On Reset
    5. 6.5 Programming
      1. 6.5.1 I2C Serial Interface
        1. 6.5.1.1 Writing to and Reading Through the I2C Serial Interface
        2. 6.5.1.2 High-Speed I2C Mode
        3. 6.5.1.3 SMBus Alert Response
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Device Measurement Range and Resolution
      2. 7.1.2 ADC Output Data Rate and Noise Performance
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 Configure the Device
        2. 7.2.2.2 Set Desired Fault Thresholds
        3. 7.2.2.3 Calculate Returned Values
      3. 7.2.3 Application Curves
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
    5. 7.5 Register Maps
      1. 7.5.1 INA745x Registers
  9. 8 Device and Documentation Support
    1. 8.1 Receiving Notification of Documentation Updates
    2. 8.2 Support Resources
    3. 8.3 Trademarks
    4. 8.4 Electrostatic Discharge Caution
    5. 8.5 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.6 Timing Requirements (I2C)

MIN NOM MAX UNIT
I2C BUS (FAST MODE)
F(SCL) I2C clock frequency 1 400 kHz
t(BUF) Bus free time between STOP and START conditions 600 ns
t(HDSTA) Hold time after a repeated START condition. After this period, the first clock is generated. 100 ns
t(SUSTA) Repeated START condition setup time 100 ns
t(SUSTO) STOP condition setup time 100 ns
t(HDDAT) Data hold time 10 900 ns
t(SUDAT) Data setup time 100 ns
t(LOW) SCL clock low period 1300 ns
t(HIGH) SCL clock high period 600 ns
tF Data fall time 300 ns
tF Clock fall time 300 ns
tR Clock rise time 300 ns
I2C BUS (HIGH-SPEED MODE)
F(SCL) I2C clock frequency 10 2940 kHz
t(BUF) Bus free time between STOP and START conditions 160 ns
t(HDSTA) Hold time after a repeated START condition. After this period, the first clock is generated. 100 ns
t(SUSTA) Repeated START condition setup time 100 ns
t(SUSTO) STOP condition setup time 100 ns
t(HDDAT) Data hold time 10 125 ns
t(SUDAT) Data setup time 20 ns
t(LOW) SCL clock low period 200 ns
t(HIGH) SCL clock high period 60 ns
tF Data fall time 80 ns
tF Clock fall time 40 ns
tR Clock rise time 40 ns