SBOSAA6A May   2024  – December 2024 INA790B

PRODUCTION DATA  

  1.   1
  2. 1Features
  3. 2Applications
  4. 3Description
  5. 4Pin Configuration and Functions
  6. 5Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  7. 6Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Integrated Shunt Resistor
      2. 6.3.2 Safe Operating Area
      3. 6.3.3 Short-Circuit Duration
      4. 6.3.4 Temperature Drift Correction
      5. 6.3.5 Enhanced PWM Rejection Operation
    4. 6.4 Device Functional Modes
      1. 6.4.1 Adjusting the Output With the Reference Pin
        1. 6.4.1.1 Reference Pin Connections for Unidirectional Current Measurements
        2. 6.4.1.2 Ground Referenced Output
        3. 6.4.1.3 Reference Pin Connections for Bidirectional Current Measurements
        4. 6.4.1.4 Output Set to Mid-Supply Voltage
      2. 6.4.2 Adjustable Gain Set Using External Resistors
        1. 6.4.2.1 Adjustable Unity Gain
      3. 6.4.3 Thermal Alert Function
  8. 7Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Calculating Total Error
        1. 7.1.1.1 Error Sources
        2. 7.1.1.2 Reference Voltage Rejection Ratio Error
        3. 7.1.1.3 External Adjustable Gain Error
        4. 7.1.1.4 Total Error Example 1
        5. 7.1.1.5 Total Error Example 2
        6. 7.1.1.6 Total Error Example 3
        7. 7.1.1.7 Total Error Curves
      2. 7.1.2 Signal Filtering
    2. 7.2 Typical Applications
      1. 7.2.1 High-Side, High-Drive, Solenoid Current-Sense Application
        1. 7.2.1.1 Design Requirements
        2. 7.2.1.2 Detailed Design Procedure
        3. 7.2.1.3 Application Curve
      2. 7.2.2 Speaker Enhancements and Diagnostics Using Current Sense Amplifier
        1. 7.2.2.1 Design Requirements
        2. 7.2.2.2 Detailed Design Procedure
        3. 7.2.2.3 Application Curve
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8Device and Documentation Support
    1. 8.1 Documentation Support
      1. 8.1.1 Related Documentation
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9Revision History

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DEK|15
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.4 Trademarks

EZShunt and TI E2E™ are trademarks of Texas Instruments.

All trademarks are the property of their respective owners.