SLLSF09E December   2017  – January 2020 ISO1042

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Application Diagram
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions—16 Pins
    2.     Pin Functions—8 Pins
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Transient Immunity
    4. 6.4  Recommended Operating Conditions
    5. 6.5  Thermal Information
    6. 6.6  Power Ratings
    7. 6.7  Insulation Specifications
    8. 6.8  Safety-Related Certifications
    9. 6.9  Safety Limiting Values
    10. 6.10 Electrical Characteristics - DC Specification
    11. 6.11 Switching Characteristics
    12. 6.12 Insulation Characteristics Curves
    13. 6.13 Typical Characteristics
  7. 7 Parameter Measurement Information
    1. 7.1 Test Circuits
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 CAN Bus States
      2. 8.3.2 Digital Inputs and Outputs: TXD (Input) and RXD (Output)
      3. 8.3.3 Protection Features
        1. 8.3.3.1 TXD Dominant Timeout (DTO)
        2. 8.3.3.2 Thermal Shutdown (TSD)
        3. 8.3.3.3 Undervoltage Lockout and Default State
        4. 8.3.3.4 Floating Pins
        5. 8.3.3.5 Unpowered Device
        6. 8.3.3.6 CAN Bus Short Circuit Current Limiting
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Bus Loading, Length and Number of Nodes
        2. 9.2.2.2 CAN Termination
      3. 9.2.3 Application Curve
    3. 9.3 DeviceNet Application
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 PCB Material
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Community Resource
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DWV|8
  • DW|16
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.6 Power Ratings

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
PD Maximum power dissipation (both sides) See Figure 17, VCC1 = VCC2 = 5.5 V, TJ = 150°C, RL = 50 Ω, A repetitive pattern on TXD with 1 ms time period, 990 µs LOW time, and 10 µs HIGH time. 385 mW
PD1 Maximum power dissipation (side-1) See Figure 19, VCC1 = VCC2 = 5.5 V, TJ = 150°C, RL = 50 Ω, Input a 2-V pk-pk 2.5-MHz 50% duty cycle differential square wave on CANH-CANL 25 mW
PD2 Maximum power dissipation (side-2) See Figure 17, VCC1 = VCC2 = 5.5 V, TJ = 150°C, RL = 50 Ω, A repetitive pattern on TXD with 1 ms time period, 990 µs LOW time, and 10 µs HIGH time. 360 mW