SLLSF09E December   2017  – January 2020 ISO1042

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Application Diagram
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions—16 Pins
    2.     Pin Functions—8 Pins
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Transient Immunity
    4. 6.4  Recommended Operating Conditions
    5. 6.5  Thermal Information
    6. 6.6  Power Ratings
    7. 6.7  Insulation Specifications
    8. 6.8  Safety-Related Certifications
    9. 6.9  Safety Limiting Values
    10. 6.10 Electrical Characteristics - DC Specification
    11. 6.11 Switching Characteristics
    12. 6.12 Insulation Characteristics Curves
    13. 6.13 Typical Characteristics
  7. 7 Parameter Measurement Information
    1. 7.1 Test Circuits
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 CAN Bus States
      2. 8.3.2 Digital Inputs and Outputs: TXD (Input) and RXD (Output)
      3. 8.3.3 Protection Features
        1. 8.3.3.1 TXD Dominant Timeout (DTO)
        2. 8.3.3.2 Thermal Shutdown (TSD)
        3. 8.3.3.3 Undervoltage Lockout and Default State
        4. 8.3.3.4 Floating Pins
        5. 8.3.3.5 Unpowered Device
        6. 8.3.3.6 CAN Bus Short Circuit Current Limiting
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Bus Loading, Length and Number of Nodes
        2. 9.2.2.2 CAN Termination
      3. 9.2.3 Application Curve
    3. 9.3 DeviceNet Application
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 PCB Material
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Community Resource
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DWV|8
  • DW|16
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.9 Safety Limiting Values

Safety limiting(1) intends to minimize potential damage to the isolation barrier upon failure of input or output circuitry.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
DW-16 PACKAGE
IS Safety input, output, or supply current RθJA = 69.9°C/W, VI = 5.5 V, TJ = 150°C, TA = 25°C, see Figure 1 325 mA
RθJA = 69.9°C/W, VI = 3.6 V, TJ = 150°C, TA = 25°C, see Figure 1 496
RθJA = 69.9°C/W, VI = 2.75 V, TJ = 150°C, TA = 25°C, see Figure 1 650
RθJA = 69.9°C/W, VI = 1.89 V, TJ = 150°C, TA = 25°C, see Figure 1 946
PS Safety input, output, or total power RθJA = 69.9°C/W, TJ = 150°C, TA = 25°C, see Figure 3 1788 mW
TS Maximum safety temperature 150 °C
DWV-8 PACKAGE
IS Safety input, output, or supply current RθJA = 100°C/W, VI = 5.5 V, TJ = 150°C, TA = 25°C, see Figure 2 227 mA
RθJA = 100°C/W, VI = 3.6 V, TJ = 150°C, TA = 25°C, see Figure 2 347
RθJA = 100°C/W, VI = 2.75 V, TJ = 150°C, TA = 25°C, see Figure 2 454
RθJA = 100°C/W, VI = 1.89 V, TJ = 150°C, TA = 25°C, see Figure 2 661
PS Safety input, output, or total power RθJA = 100°C/W, TJ = 150°C, TA = 25°C, see Figure 4 1250 mW
TS Maximum safety temperature 150 °C
(1) The maximum safety temperature, TS, has the same value as the maximum junction temperature, TJ, specified for the device. The IS and PS parameters represent the safety current and safety power respectively. The maximum limits of IS and PS should not be exceeded. These limits vary with the ambient temperature, TA. 

The junction-to-air thermal resistance, RθJA, in the table is that of a device installed on a high-K test board for leaded surface-mount packages. Use these equations to calculate the value for each parameter:
TJ = TA + RθJA × P, where P is the power dissipated in the device.
TJ(max) = TS = TA + RθJA × PS, where TJ(max) is the maximum allowed junction temperature.
PS = IS × VI, where VI is the maximum input voltage.