SLLS983L June   2009  – October 2023 ISO1050

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Revision History
  6. Pin Configuration and Functions
  7. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Power Ratings
    6. 6.6  Insulation Specifications
    7. 6.7  Safety-Related Certifications
    8. 6.8  Safety Limiting Values
    9. 6.9  Electrical Characteristics - DC Specification
    10. 6.10 Switching Characteristics
    11. 6.11 Insulation Characteristics Curves
    12. 6.12 Typical Characteristics
  8. Parameter Measurement Information
  9. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 CAN Bus States
      2. 8.3.2 Digital Inputs and Outputs
      3. 8.3.3 Protection Features
        1. 8.3.3.1 TXD Dominant Time-Out (DTO)
        2. 8.3.3.2 Thermal Shutdown
        3. 8.3.3.3 Undervoltage Lockout and Fail-Safe
        4. 8.3.3.4 Floating Pins
        5. 8.3.3.5 CAN Bus Short-Circuit Current Limiting
    4. 8.4 Device Functional Modes
  10. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Bus Loading, Length and Number of Nodes
        2. 9.2.2.2 CAN Termination
      3. 9.2.3 Application Curve
  11. 10Power Supply Recommendations
    1. 10.1 General Recommendations
    2. 10.2 Power Supply Discharging
  12. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 PCB Material
    2. 11.2 Layout Example
  13. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  14. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Absolute Maximum Ratings

Over operating free-air temperature range (unless otherwise noted)(1)(2)
MIN MAX UNIT
VCC1 Supply voltage, side 1 -0.5 6 V
VCC2 Supply voltage, side 2 -0.5 6 V
VIO Logic input voltage range (TXD) -0.5 VCC1+0.5(3) V
VBUS Voltage on bus pins (CANH, CANL) -27 40 V
IO Output current on RXD pin -15 15 mA
TJ Junction temperature -55 150
TSTG Storage temperature -65 150
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltage values except differential I/O bus voltages are with respect to the local ground terminal (GND1 or GND2) and are peak voltage values.
Maximum voltage must not exceed 6 V