SLLS897F march   2008  – august 2023 ISO1176

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Power Ratings
    6. 6.6  Insulation Specifications
    7. 6.7  Safety-Related Certifications
    8. 6.8  Safety Limiting Values
    9. 6.9  Electrical Characteristics: Driver
    10. 6.10 Electrical Characteristics: Receiver
    11. 6.11 Supply Current
    12. 6.12 Electrical Characteristics: ISODE-Pin
    13. 6.13 Switching Characteristics: Driver
    14. 6.14 Switching Characteristics: Receiver
    15. 6.15 Insulation Characteristics Curves
    16. 6.16 Typical Characteristics
  8. 7 Parameter Measurement Information
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Device Functional Modes
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Transient Voltages
        2. 9.2.2.2 ISO1176 “Sticky Bit” Issue (Under Certain Conditions)
      3. 9.2.3 Application Curve
  11. 10Power Supply Recommendations
  12. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  13. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Support Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  14. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from Revision E (June 2015) to Revision F (August 2023)

  • Updated the numbering format for tables, figures, and cross-references throughout the documentGo
  • Updated Thermal Characteristics, Safety Limiting Values, and Thermal Derating Curves to provide more accurate system-level thermal calculationsGo
  • Updated electrical and switching characteristics to match device performanceGo

Changes from Revision D (March 2010) to Revision E (June 2015)

  • Added Pin Configuration and Functions section, ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section Go
  • VDE standard changed to DIN V VDE V 0884-10 (VDE V 0884-10): 2006-12Go

Changes from Revision C (October 2008) to Revision D (March 2010)

  • Added 560-Vpeak VIORM to the first Features ListGo
  • Added UL 1577, IEC 60747-5-2 (VDE 0884, Rev. 2), to the Features ListGo
  • Changed the ISO1176 “Sticky Bit” Issue sectionGo

Changes from Revision B (June 2008) to Revision C (October 2008)

  • Changed the text in the second paragraph of the DESCRIPTION From: "whenever the driver is disabled or VCC2 = 0" To: "allowing up to 160 nodes."Go

Changes from Revision A (May 2008) to Revision B (June 2008)

    Changes from Revision * (March 2008) to Revision A (May 2008)

    • Added 3.3-V Inputs are 5-V Tolerant to the Features ListGo
    • Added the Bus-Pin ESD Protection bullet and sub bullets to the Features ListGo
    • Added the APPLICATION INFORMATION sectionGo