SLLSE28H october   2010  – august 2023 ISO1176T

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
    1.     Pin Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Power Ratings
    6. 6.6  Insulation Specifications
    7. 6.7  Safety-Related Certifications
    8. 6.8  Safety Limiting Values
    9. 6.9  Electrical Characteristics: ISODE-Pin
    10. 6.10 Electrical Characteristics: Driver
    11. 6.11 Electrical Characteristics: Receiver
    12. 6.12 Supply Current
    13. 6.13 Transformer Driver Characteristics
    14. 6.14 Switching Characteristics: Driver
    15. 6.15 Switching Characteristics: Receiver
    16. 6.16 Insulation Characteristics Curves
    17. 6.17 Typical Characteristics
  8. 7 Parameter Measurement Information
    1.     27
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Device Functional Modes
      1. 8.3.1 Device I/O Schematics
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Transient Voltages
          1. 9.2.2.1.1 39
      3. 9.2.3 Application Curve
  11. 10Power Supply Recommendations
  12. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  13. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Community Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  14. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

THERMAL METRIC(1) ISO1176T UNIT
DW (SOIC)
16 PINS
RθJA Junction-to-ambient thermal resistance 76 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 37.9 °C/W
RθJB Junction-to-board thermal resistance 44.6 °C/W
ψJT Junction-to-top characterization parameter 13.9 °C/W
ψJB Junction-to-board characterization parameter 37.9 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance - °C/W
(1) For more information about traditional and new thermal metrics, see the no.