SLLSEY7F June   2017  – April 2020 ISO1211 , ISO1212

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.          Application Diagram
      2.      ISO121x Devices Reduce Board Temperatures vs Traditional Solutions
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
    2.     Pin Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Power Ratings
    6. 6.6  Insulation Specifications
    7. 6.7  Safety-Related Certifications
    8. 6.8  Safety Limiting Values
    9. 6.9  Electrical Characteristics—DC Specification
    10. 6.10 Switching Characteristics—AC Specification
    11. 6.11 Insulation Characteristics Curves
    12. 6.12 Typical Characteristics
  7. 7 Parameter Measurement Information
    1. 7.1 Test Circuits
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Sinking Inputs
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
          1. 9.2.1.2.1 Setting Current Limit and Voltage Thresholds
          2. 9.2.1.2.2 Thermal Considerations
          3. 9.2.1.2.3 Designing for 48-V Systems
          4. 9.2.1.2.4 Designing for Input Voltages Greater Than 60 V
          5. 9.2.1.2.5 Surge, ESD, and EFT Tests
          6. 9.2.1.2.6 Multiplexing the Interface to the Host Controller
          7. 9.2.1.2.7 Status LEDs
        3. 9.2.1.3 Application Curve
      2. 9.2.2 Sourcing Inputs
      3. 9.2.3 Sourcing and Sinking Inputs (Bidirectional Inputs)
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Development Support
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Related Links
    4. 12.4 Receiving Notification of Documentation Updates
    5. 12.5 Community Resource
    6. 12.6 Trademarks
    7. 12.7 Electrostatic Discharge Caution
    8. 12.8 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.5 Power Ratings

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
ISO1211
PD Maximum power dissipation, both sides VSENSE = 60 V, VCC1 = 5.5 V, RSENSE = 200 Ω, RTHR = 0 Ω, TJ = 150°C 450 mW
PD1 Maximum power dissipation, output side (side 1) VCC1 = 5.5 V, CL = 15 pF, Input 2-MHz 50% duty-cycle square wave at SENSE pin, TJ = 150°C 20 mW
PD2 Maximum power dissipation, field input side VSENSE = 60 V, VCC1 = 5.5 V, RSENSE = 200 Ω, RTHR = 0 Ω, TJ = 150°C 430 mW
ISO1212
PD Maximum power dissipation, both sides VSENSEx = 60 V, VCC1 = 5.5 V, RSENSE = 200 Ω, RTHR = 0 Ω, TJ = 150°C 900 mW
PD1 Maximum power dissipation, output side (side 1) VCC1 = 5.5 V, CL = 15 pF, Input 2-MHz 50% duty-cycle square wave at SENSEx pins, TJ = 150°C 40 mW
PD2 Maximum power dissipation, field input side VSENSEx = 60 V, VCC1 = 5.5 V, RSENSE = 200 Ω, RTHR = 0 Ω, TJ = 150°C 860 mW