SLLSFN5A June   2023  – February 2024 ISO1228

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Power Ratings
    6. 5.6  Insulation Specifications
    7. 5.7  Safety-Related Certifications
    8. 5.8  Safety Limiting Values
    9. 5.9  Electrical Characteristics—DC Specification
    10. 5.10 Switching Characteristics—AC Specification
    11. 5.11 Typical Characteristics
  7. 6 Parameter Measurement Information
    1. 6.1 Test Circuits
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Surge Protection
      2. 7.3.2  Field Side LED Indication
      3. 7.3.3  Serial and Parallel Output option
      4. 7.3.4  Cyclic Redundancy Check (CRC)
      5. 7.3.5  FAULT Indication
      6. 7.3.6  Digital Low Pass Filter
      7. 7.3.7  SPI Register Map
      8. 7.3.8  SPI Interface Timing - Non-Daisy Chain
      9. 7.3.9  SPI Interface Timing - Daisy Chain
      10. 7.3.10 SPI Interface Timing - Burst Mode
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Sinking Type Digital Inputs
      2. 8.2.2 Sourcing Type Digital Inputs
      3. 8.2.3 Design Requirements
        1. 8.2.3.1 Detailed Design Procedure
          1. 8.2.3.1.1 Current Limit
          2. 8.2.3.1.2 Voltage Thresholds
          3. 8.2.3.1.3 Wire-Break Detection
  10. 9 Power Supply Recommendations
  11. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  12. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  13. 12Revision History
  14. 13Mechanical, Packaging, and Orderable Information
    1. 13.1 Tape and Reel Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.4 Thermal Information

THERMAL METRIC(1) ISO1228 UNIT
DFB (SSOP)
38 PINS
RθJA Junction-to-ambient thermal resistance 91.8 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 50.5 °C/W
RθJB Junction-to-board thermal resistance 58.2 °C/W
ψJT Junction-to-top characterization parameter 30.3 °C/W
ψJB Junction-to-board characterization parameter 57.7 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance — °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.