SBOS074E September   1997  – June 2018 ISO124

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Simplified Schematic
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
      1. 7.1.1 Modulator
      2. 7.1.2 Demodulator
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Isolation Amplifier
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Carrier Frequency Considerations
      2. 8.1.2 Isolation Mode Voltage Induced Errors
      3. 8.1.3 High IMV dV/dt Errors
      4. 8.1.4 High Voltage Testing
    2. 8.2 Typical Applications
      1. 8.2.1 Output Filters
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curves
      2. 8.2.2 Battery Monitor
      3. 8.2.3 Programmable Gain Amplifier
      4. 8.2.4 Thermocouple Amplifier
      5. 8.2.5 Isolated 4-mA to 20-mA Instrument Loop
      6. 8.2.6 Single-Supply Operation of the ISO124 Isolation Amplifier
      7. 8.2.7 Input-Side Powered ISO Amplifier
      8. 8.2.8 Powered ISO Amplifier With Three-Port Isolation
  9. 9 Power Supply Recommendations
    1. 9.1 Signal and Supply Connections
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • NVF|8
  • DVA|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

THERMAL METRIC(1) ISO124 UNIT
DVA (SOIC) NVF (PDIP)
28 PINS 16 PINS
RθJA Junction-to-ambient thermal resistance 79.8 51.0 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 32.9 32.4 °C/W
RθJB Junction-to-board thermal resistance 42.2 29.5 °C/W
ψJT Junction-to-top characterization parameter 6.6 10.4 °C/W
ψJB Junction-to-board characterization parameter 40.9 29.0 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.