SLLSF22H April   2018  – June 2024 ISO1410 , ISO1412 , ISO1430 , ISO1432 , ISO1450 , ISO1452

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Description Continued
  6. 5 Device Comparison Table
  7. 6 Pin Configuration and Functions
    1.     Pin Functions: Full-Duplex Device
    2.     Pin Functions: Half-Duplex Device
  8. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Power Ratings
    6. 7.6  Insulation Specifications
    7. 7.7  Safety-Related Certifications
    8. 7.8  Safety Limiting Values
    9. 7.9  Electrical Characteristics: Driver
    10. 7.10 Electrical Characteristics: Receiver
    11. 7.11 Supply Current Characteristics: Side 1 (ICC1)
    12. 7.12 Supply Current Characteristics: Side 2 (ICC2)
    13. 7.13 Switching Characteristics: Driver
    14. 7.14 Switching Characteristics: Receiver
    15. 7.15 Insulation Characteristics Curves
    16. 7.16 Typical Characteristics
  9. 8 Parameter Measurement Information
  10. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Electromagnetic Compatibility (EMC) Considerations
      2. 9.3.2 Failsafe Receiver
      3. 9.3.3 Thermal Shutdown
      4. 9.3.4 Glitch-Free Power Up and Power Down
    4. 9.4 Device Functional Modes
      1. 9.4.1 Device I/O Schematics
  11. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1 Data Rate and Bus Length
        2. 10.2.2.2 Stub Length
        3. 10.2.2.3 Bus Loading
      3. 10.2.3 Application Curves
        1. 10.2.3.1 Insulation Lifetime
  12. 11Power Supply Recommendations
  13. 12Layout
    1. 12.1 Layout Guidelines
      1. 12.1.1 PCB Material
    2. 12.2 Layout Example
  14. 13Device and Documentation Support
    1. 13.1 Documentation Support
      1. 13.1.1 Related Documentation
        1. 13.1.1.1 Related Links
    2. 13.2 Receiving Notification of Documentation Updates
    3. 13.3 Support Resources
    4. 13.4 Trademarks
    5. 13.5 Electrostatic Discharge Caution
    6. 13.6 Glossary
  15. 14Revision History
  16. 15Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DW|16
Thermal pad, mechanical data (Package|Pins)
Orderable Information

14 Revision History

Changes from Revision G (May 2020) to Revision H (June 2024)

  • Updated the number format for tables, figures, and cross-references throughout the documentGo

Changes from Revision F (February 2020) to Revision G (May 2020)

Changes from Revision E (October 2019) to Revision F (February 2020)

Changes from Revision D (May 2019) to Revision E (October 2019)

  • Added footnote to Pin functions table for NC pins Go

Changes from Revision C (April 2019) to Revision D (May 2019)

  • Added B part numbers throughout datasheet Go

Changes from Revision B (November 2018) to Revision C (April 2019)

  • Added ISO1430, ISO1432, ISO1450, ISO1452 in Device Information tableGo
  • Changed Device Features tables to Device Comparison tableGo
  • Changed the position of Device Features tables Go
  • Added footnote to Pin Functions: Full-Duplex DeviceGo
  • Added footnote to Pin Functions: Half-Duplex DeviceGo
  • Added Typical curves for ISO143x and ISO145x in Section 7.16 Go
  • Added Section 11.2.3 Application Curves and Section 11.2.3.1 Insulation LifetimeGo

Changes from Revision A (August 2018) to Revision B (November 2018)

  • Changed status to production data Go

Changes from Revision * (July 2018) to Revision A (August 2018)

  • Changed the designator of common mode voltage in Recommended operating condition to VI Go
  • Added test condition for CMTI in Electrical characteristics: Driver   Go
  • Added test condition for CMTI in Electrical characteristics: ReceiverGo
  • Changed VTEST to VCM in the Common Mode Transient Immunity (CMTI)—Full Duplex and Common Mode Transient Immunity (CMTI)—Half Duplex figures in the Parameter Measurement Information sectionGo
  • Changed tPLH to tPZH and tPLZ to tPHZ in the first Driver Enable and Disable Times timing diagram in the Parameter Measurement Information sectionGo
  • Added tPHZ to the first Receiver Enable and Disable Times timing diagram in the Parameter Measurement Information section Go